Taiwan semiconductor manufacturing co., ltd. (20250087536). DEPOSITION SYSTEM AND METHOD
DEPOSITION SYSTEM AND METHOD
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hsuan-Chih Chu of Hsinchu (TW)
DEPOSITION SYSTEM AND METHOD
This abstract first appeared for US patent application 20250087536 titled 'DEPOSITION SYSTEM AND METHOD
Original Abstract Submitted
a deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. the deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. to adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. as a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.
