19001089. DEPOSITION SYSTEM AND METHOD (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
DEPOSITION SYSTEM AND METHOD
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
DEPOSITION SYSTEM AND METHOD
This abstract first appeared for US patent application 19001089 titled 'DEPOSITION SYSTEM AND METHOD
Original Abstract Submitted
A deposition system is provided capable of extending the chamber running time by preventing the target and other components from deformation due to thermal stress from the sputtering process by maintaining the temperature within the predetermined temperature range. The deposition system includes a substrate process chamber, a target within the substrate process chamber, and a plurality of grooves formed on the target in a circular formation. The plurality of grooves includes a first groove on a center portion of the target and a second groove on a periphery portion of the target.