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18911171. Substrate Processing Apparatus (TOKYO ELECTRON LIMITED)
[[Category:H01J37/34]] [[Category:H01J37/32]] ...

1 KB (155 words) - 09:48, 22 April 2025
Applied materials, inc. (20240420937). GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA
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2 KB (273 words) - 06:48, 19 December 2024
18732308. GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA (Applied Materials, Inc.)
[[Category:H01J37/34]] [[Category:H01J37/317]] ...

2 KB (273 words) - 07:17, 19 December 2024
18999547. SPUTTERING TARGET, METHOD OF BONDING TARGET MATERIAL AND BACKING PLATE, AND METHOD OF MANUFACTURING SPUTTERING TARGET (SUMITOMO CHEMICAL COMPANY, LIMITED)
[[Category:H01J37/34]] [[Category:C23C14/34]] ...

996 bytes (126 words) - 06:16, 23 April 2025
Taiwan semiconductor manufacturing co., ltd. (20250087536). DEPOSITION SYSTEM AND METHOD
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2 KB (233 words) - 02:46, 15 March 2025
18957378. DEPOSITION SYSTEM AND METHOD (Taiwan Semiconductor Manufacturing Co., Ltd.)
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2 KB (233 words) - 04:05, 15 March 2025
US Patent Application 18361771. SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS simplified abstract
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2 KB (245 words) - 08:35, 6 December 2023
US Patent Application 18361767. SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS simplified abstract
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2 KB (252 words) - 08:35, 6 December 2023
Taiwan semiconductor manufacturing co., ltd. (20250092508). PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
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1 KB (216 words) - 03:30, 24 March 2025
18962406. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
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1 KB (216 words) - 04:51, 24 March 2025
Taiwan semiconductor manufacturing co., ltd. (20250095975). SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING
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2 KB (293 words) - 03:31, 24 March 2025
18961099. SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING (Taiwan Semiconductor Manufacturing Co., Ltd.)
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2 KB (293 words) - 04:52, 24 March 2025
Taiwan semiconductor manufacturing co., ltd. (20240429036). PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
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2 KB (227 words) - 02:56, 30 December 2024
18281456. SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE simplified abstract (Applied Materials, Inc.)
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4 KB (542 words) - 06:50, 19 September 2024
18512324. CONSUMABLE COMPONENT TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SEMES CO., LTD.)
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4 KB (489 words) - 06:14, 28 June 2024
18418930. METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER simplified abstract (Applied Materials, Inc.)
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3 KB (476 words) - 09:40, 11 June 2024
Taiwan semiconductor manufacturing co., ltd. (20240183025). FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING simplified abstract
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4 KB (523 words) - 02:48, 10 June 2024
US Patent Application 18360667. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME simplified abstract
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2 KB (274 words) - 04:02, 4 December 2023
US Patent Application 18361729. DEPOSITION SYSTEM AND METHOD simplified abstract
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2 KB (296 words) - 08:38, 6 December 2023
US Patent Application 18341506. DEPOSITION SYSTEM AND METHOD simplified abstract
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2 KB (368 words) - 02:38, 4 December 2023

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