There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L24/80
Pages in category "CPC H01L24/80"
The following 142 pages are in this category, out of 142 total.
1
- 18078416. Integrated process sequence for hybrid bonding applications simplified abstract (Applied Materials, Inc.)
- 18089732. Structures and Processes for Void-Free Hybrid Bonding simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18148332. DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18188597. IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18320791. BONDING LAYER AND PROCESS simplified abstract (Tokyo Electron Limited)
- 18326316. Bonding Semiconductor Dies Through Wafer Bonding Processes simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18348092. PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18370840. METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS (Tokyo Electron Limited)
- 18374520. SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (INTEL CORPORATION)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18400697. HYBRID BONDING WITH SONIC ENERGY simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18491556. METHOD INCLUDING POSITIONING A SOURCE DIE OR A DESTINATION SITE TO COMPENSATE FOR OVERLAY ERROR (Canon Kabushiki Kaisha)
- 18527552. BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18532064. STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18592124. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18592860. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18622040. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18624954. WAFER BONDING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18625419. BONDING METHOD AND BONDING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18647450. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 19010591. BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS (Taiwan Semiconductor Manufacturing Company, Ltd.)
2
- 20250167167. Die Stacking Inte (Applied Materials, .)
- 20250174594. System Method (CANON KABUSHIKI KAISHA)
- 20250174595. M (Taiwan Semiconductor Manufacturing ., .)
- 20250219015. Method Bonding Chips (CANON KABUSHIKI KAISHA)
- 20250219016. Semiconductor Structure Manufacturing Method Ther (Taiwan Semiconductor Manufacturing , .)
- 20250233103. Method Manufacturing (HD MICROSYSTEMS, .)
- 20250233104. Method F (SUSS MicroTec Solutions & . KG)
- 20250233105. System Metho (Ontos Equipment Systems, .)
- 20250233106. Integrated Semiconductor Packaging System Enhanced Dielectric-to-dielectric Bonding Qual (Taiwan Semiconductor Manufacturing , .)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2025
- Advanced micro devices Patent Application Trends in 2024
- ADVANTEST CORPORATION Patent Application Trends in 2024
- Amkor Technology Singapore Holding Pte. Ltd. Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- Apple Patent Application Trends in 2024
- Applied materials, inc. (20240266319). Method of Multi-layer Die Stacking with Die-to-Wafer Bonding simplified abstract
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on August 8th, 2024
- Avago Technologies International Sales Pte. Limited Patent Application Trends in 2025
C
- Canon kabushiki kaisha (20240194636). BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240213211). STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESSING METHOD, AND BONDING METHOD simplified abstract
- Canon kabushiki kaisha (20250132285). METHOD INCLUDING POSITIONING A SOURCE DIE OR A DESTINATION SITE TO COMPENSATE FOR OVERLAY ERROR
- CANON KABUSHIKI KAISHA Patent Application Trends in 2025
- Canon Kabushiki Kaisha Patent Application Trends in 2025
- Canon Kabushiki Kaisha patent applications on April 24th, 2025
- CANON KABUSHIKI KAISHA patent applications on June 13th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 27th, 2024
- Cisco Technology, Inc. Patent Application Trends in 2025
I
- IMEC VZW Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20250079392). HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCALABILITY
- Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on March 6th, 2025
- International business machines corporation (20240222313). Structures and Processes for Void-Free Hybrid Bonding simplified abstract
- International Business Machines Corporation Patent Application Trends in 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 4th, 2024
K
- Kioxia corporation (20240297145). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240321819). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract
- Kioxia Corporation Patent Application Trends in 2024
- KIOXIA CORPORATION Patent Application Trends in 2025
- Kioxia Corporation patent applications on September 26th, 2024
- KIOXIA CORPORATION patent applications on September 5th, 2024
M
- Macronix International Co., Ltd. Patent Application Trends in 2025
- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2025
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Murata Manufacturing Co., Ltd. Patent Application Trends in 2025
Q
R
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250070079). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250079393). SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Samsung electronics co., ltd. (20250118702). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 10th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 10th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SK hynix Inc. Patent Application Trends in 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2024
- STMicroelectronics International N.V. Patent Application Trends in 2025
- Stroke Precision Advanced Engineering Co., Ltd. Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240250061). WAFER BONDING METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312952). Bonding Semiconductor Dies Through Wafer Bonding Processes simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240379614). MULTI-LEVEL STACKING OF WAFERS AND CHIPS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250015041). PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250149500). BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 9th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- Tesla, Inc. Patent Application Trends in 2025
- Tokyo electron limited (20240339431). BONDING METHOD AND BONDING SYSTEM simplified abstract
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- Tokyo Electron Limited patent applications on October 10th, 2024