ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Filing Activity
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. patent applications in 2025
Top 10 Technology Areas
- H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 13 patents
- Example: 20250038104. INTEGRATED CIRCUITS WITH CAPACITORS (Adeia Semiconductor Bonding Technologies Inc.)
- H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})
- Count: 11 patents
- Example: 20250038104. INTEGRATED CIRCUITS WITH CAPACITORS (Adeia Semiconductor Bonding Technologies Inc.)
- H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 10 patents
- Example: 20250038104. INTEGRATED CIRCUITS WITH CAPACITORS (Adeia Semiconductor Bonding Technologies Inc.)
- H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 8 patents
- Example: 20250038104. INTEGRATED CIRCUITS WITH CAPACITORS (Adeia Semiconductor Bonding Technologies Inc.)
- H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 6 patents
- Example: 20250038104. INTEGRATED CIRCUITS WITH CAPACITORS (Adeia Semiconductor Bonding Technologies Inc.)
- H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/528 ({Geometry or} layout of the interconnection structure {()
- H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
- H01L2224/80805 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/4336 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/46 (involving the transfer of heat by flowing fluids ()
- H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L23/49872 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate)
- H01L23/367 (Cooling facilitated by shape of device {()
- Count: 1 patents
- Example: 20250054837. ELECTRONIC DEVICE COOLING STRUCTURES (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H01L23/473 (by flowing liquids {()
- Count: 1 patents
- Example: 20250054837. ELECTRONIC DEVICE COOLING STRUCTURES (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- H10K39/32 (ORGANIC ELECTRIC SOLID-STATE DEVICES)
- H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups)
Top Inventors
- Rajesh Katkar of Milpitas CA (US) (14 patents)
- Belgacem Haba of Saratoga CA (US) (13 patents)
- Cyprian Emeka Uzoh of San Jose CA (US) (12 patents)
- Thomas Workman of San Jose CA (US) (4 patents)
- Laura Wills Mirkarimi of Sunol CA (US) (4 patents)
- Gabriel Z. Guevara of Gilroy CA (US) (3 patents)
- Guilian Gao of Campbell CA (US) (3 patents)
- Gaius Gillman Fountain, JR. of Youngsville NC (US) (3 patents)
- Xu CHANG of San Jose CA (US) (2 patents)
- Rajesh KATKAR of Milpitas CA (US) (2 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Companies
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- Patent Trends by Company in 2025
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