WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2024
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Filing Activity
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications in 2024
Top 10 Technology Areas
- H01L25/0652 (No explanation available)
- H01L21/76898 (No explanation available)
- H01L24/08 (No explanation available)
- H01L24/80 (No explanation available)
- H01L24/83 (No explanation available)
- H01L25/50 (No explanation available)
- H01L2224/08145 (No explanation available)
- H01L2224/80896 (No explanation available)
- H01L27/1469 (No explanation available)
- H01L27/14634 (No explanation available)
Emerging Technology Areas
- H01L2224/83893 (No explanation available)
- H01L21/78 (No explanation available)
- H01L21/6831 (No explanation available)
- H01L29/7816 (No explanation available)
- H01L29/66681 (No explanation available)
- H01L21/266 (No explanation available)
- H01L21/26513 (No explanation available)
- H01L21/2253 (No explanation available)
- G06F3/0659 (No explanation available)
- Count: 1 patents
- Example: 20240111415. MEMORY CHIP simplified abstract (WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- G06F3/0604 (No explanation available)
- Count: 1 patents
- Example: 20240111415. MEMORY CHIP simplified abstract (WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.)
Top Inventors
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- Sheng HU (8 patents)
- Guoliang YE (5 patents)
- Tianjian LIU (5 patents)
- Peng SUN (4 patents)
- Jun ZHOU (3 patents)
- Wanli GUO (3 patents)
- Shengjin SONG (2 patents)
- Ying WANG (2 patents)
- Le LI (2 patents)
- Daohong YANG (2 patents)
Patent Categories
Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. Inventor States 2024 - Up to June 2024
Categories:
- Pages with broken file links
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Companies
- CPC H01L27/1469
- CPC H01L27/14634
- CPC H01L29/41775
- CPC H01L29/401
- CPC H01L29/7838
- CPC H01L23/15
- CPC H01L21/4807
- CPC H01L23/481
- CPC H01L24/16
- CPC H01L24/73
- CPC H01L25/0652
- CPC H01L2224/16227
- CPC H01L2224/73203
- CPC H01L2225/06517
- CPC H01L2225/06544
- CPC G06F3/0619
- CPC G06F3/0652
- CPC G06F3/0653
- CPC G06F3/0679
- CPC H01L27/1464
- CPC H01L27/14685
- CPC H04N25/77
- CPC H01L27/14612
- CPC H01L27/14643
- CPC H04N25/766
- CPC G11C16/0483
- CPC G11C16/08
- CPC H01L27/088
- CPC G11C16/10
- CPC G11C16/16
- CPC G11C16/26
- CPC H01L21/76838
- CPC H01L21/76898
- CPC H01L24/19
- CPC H01L24/08
- CPC H01L23/544
- CPC H01L24/20
- CPC H01L24/80
- CPC H01L24/95
- CPC H01L24/94
- CPC H01L24/92
- CPC H01L24/83
- CPC H01L24/82
- CPC H01L24/24
- CPC H01L25/50
- CPC H01L2224/08145
- CPC H01L2224/19
- CPC H01L2224/211
- CPC H01L2224/08225
- CPC H01L2224/80896
- CPC H01L2224/80357
- CPC H01L2224/95
- CPC H01L2224/94
- CPC H01L2224/92244
- CPC H01L2224/8313
- CPC H01L2224/821
- CPC H01L2224/32145
- CPC H01L2224/24145
- CPC H01L2224/24147
- CPC H01L2223/54426
- CPC H01L27/1463
- CPC H01L27/14632
- CPC H01L27/14687
- CPC H01L21/6836
- CPC H01L2221/68327
- CPC H01L2224/8385
- CPC H01L2224/83191
- CPC H01L29/42356
- CPC H01L29/0653
- CPC H01L29/0684
- CPC H01L29/1095
- CPC H01L29/66477
- CPC H01L29/78
- CPC H10B41/27
- CPC G11C16/14
- CPC H10B41/10
- CPC H10B43/10
- CPC H10B43/27
- CPC H01L27/11582
- CPC H01L27/11556
- CPC H01L23/46
- CPC H01L23/5283
- CPC H01L23/50
- CPC H01L23/49811
- CPC H01L21/4853
- CPC H10B80/00
- CPC H01L25/0657
- CPC H01L25/18
- CPC H01L2224/80895
- CPC H01L2924/1431
- CPC H01L2924/14511
- CPC H01L21/8221
- CPC H01L21/0274
- CPC H01L21/3043
- CPC H01L24/11
- CPC H01L24/13
- CPC H01L24/742
- CPC H01L2224/11462
- CPC H01L2224/13023
- CPC H01L2224/742
- CPC H01L2924/40
- CPC G06F3/0604
- CPC G06F3/0659
- CPC H01L21/2253
- CPC H01L21/26513
- CPC H01L21/266
- CPC H01L29/66681
- CPC H01L29/7816
- CPC H01L21/6831
- CPC H01L21/78
- CPC H01L2224/83893
- Patent Trends by Company in 2024