Samsung electronics co., ltd. (20250079393). SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
Sang Cheon Park of Suwon-si (KR)
Un-Byoung Kang of Suwon-si (KR)
Jun Woo Myung of Suwon-si (KR)
Seung-Jin Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
This abstract first appeared for US patent application 20250079393 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Original Abstract Submitted
a semiconductor package includes: a first semiconductor chip including a first substrate and a first through electrode passing through the first substrate, wherein the first substrate has a first active surface and a first non-active surface; a chip structure including a plurality of second semiconductor chips stacked on the first semiconductor chip, wherein each second semiconductor chip includes a second substrate and a second through electrode passing through the second substrate; and a third semiconductor chip disposed on the chip structure, and including a third substrate, wherein the first substrate has a first width and a first thickness, wherein the second substrate has a second width and a second thickness, and the third substrate has a third width and a third thickness, wherein the third thickness is thicker than the second thickness, and the third width is greater than the second width.