Resonac Corporation Patent Application Trends in 2025
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Resonac Corporation Patent Filing Activity
Resonac Corporation patent applications in 2025
Top 10 Technology Areas
- C30B29/36 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,)
- Count: 5 patents
- Example: 20250034754. SiC INGOT AND METHOD FOR MANUFACTURING SiC INGOT (Resonac Corporation)
- H01L21/02378 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- B29K2101/12 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES)
- C22C21/02 (ALLOYS (flints)
- G11B5/672 ({having different compositions in a plurality of magnetic layers, e.g. layer compositions having differing elemental components or differing proportions of elements})
- G11B5/851 (INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer)
- B29K2995/0039 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES)
- G06N20/00 (Machine learning)
- B01J37/0201 (CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS)
- Count: 2 patents
- Example: 20250002432. METHOD FOR PRODUCING (E)-1,1,1,4,4,4-HEXAFLUORO-2-BUTENE (Resonac Corporation)
- G16C20/30 (Prediction of properties of chemical compounds, compositions or mixtures)
- Count: 2 patents
- Example: 20250046403. DESIGN SUPPORT DEVICE, DESIGN SUPPORT METHOD, AND PROGRAM (Resonac Corporation)
Emerging Technology Areas
- H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- H01L2224/03845 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})
- Count: 1 patents
- Example: 20250105205. LAMINATE MANUFACTURING METHOD AND LAMINATE (Resonac Corporation)
- G11B5/855 (INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer)
- Count: 1 patents
- Example: 20250104737. HEATING DEVICE AND METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM (Resonac Corporation)
- G11B5/667 (including a soft magnetic layer)
- Count: 1 patents
- Example: 20250104737. HEATING DEVICE AND METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM (Resonac Corporation)
- C23C14/5806 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
- Count: 1 patents
- Example: 20250101574. HEATING DEVICE AND METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM (Resonac Corporation)
Top Inventors
- Hiromasa SUO (5 patents)
- Yoshishige OKUNO (4 patents)
- Nobuyuki TAKAHASHI (3 patents)
- Shimpei TAKEMOTO (3 patents)
- Takeshi SAITO (2 patents)
- Kazuya KAMIMURA (2 patents)
- Yuto TOMITA (2 patents)
- Yoshifumi KIMURA (2 patents)
- Takayuki FUKUSHIMA (2 patents)
- Takehiro YAMAGUCHI (2 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
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- Resonac Corporation
- Companies
- CPC B29C65/4835
- CPC B29C65/5057
- CPC B29C66/73751
- CPC B29C66/7394
- CPC C22F1/047
- CPC B22D11/003
- CPC B22D11/045
- CPC C22C21/02
- CPC C30B29/36
- CPC C01B32/956
- CPC C01P2002/70
- CPC G01N23/2055
- CPC H01L21/02378
- CPC G11B5/672
- CPC G11B5/851
- CPC H05K7/20263
- CPC B29C45/14778
- CPC B29K2101/12
- CPC B29K2663/00
- CPC B29K2671/00
- CPC B29K2995/0039
- CPC B29C66/7422
- CPC B29C65/02
- CPC B29K2705/02
- CPC B29K2995/0077
- CPC B29L2031/3044
- CPC B60R19/03
- CPC B60R19/04
- CPC G06N20/00
- CPC H01G9/0036
- CPC H01G9/15
- CPC C07C17/358
- CPC B01J23/04
- CPC B01J23/26
- CPC B01J35/635
- CPC B01J35/638
- CPC B01J37/0201
- CPC C07C67/04
- CPC B01J21/08
- CPC B01J23/6527
- CPC B01J37/0236
- CPC C22F1/043
- CPC G01N25/16
- CPC G01N5/02
- CPC G01N25/58
- CPC G03F7/033
- CPC G03F7/031
- CPC H01L23/293
- CPC H01L21/56
- CPC H01L23/3135
- CPC H01L23/488
- CPC G16C20/50
- CPC G16C20/30
- CPC H01L21/568
- CPC H01L21/02334
- CPC H01L21/02345
- CPC H05K3/38
- CPC C30B23/063
- CPC C30B33/00
- CPC G01N33/442
- CPC B24B37/005
- CPC C07C29/36
- CPC B01J31/20
- CPC B01J31/2213
- CPC B01J2231/321
- CPC B01J2531/822
- CPC C30B25/12
- CPC C30B25/14
- CPC H01L21/02529
- CPC H01L21/02634
- CPC H01L29/1608
- CPC G06F30/27
- CPC B29C65/4815
- CPC B29C65/14
- CPC B32B15/092
- CPC B32B27/06
- CPC B32B27/285
- CPC B32B27/38
- CPC B29L2009/003
- CPC B29L2009/005
- CPC B32B2250/02
- CPC B32B2311/24
- CPC B32B2363/00
- CPC C09C3/12
- CPC C09C1/40
- CPC B23K35/0244
- CPC B23K35/262
- CPC B23K35/322
- CPC C09K3/1454
- CPC B24B37/042
- CPC C09G1/02
- CPC C09K3/1409
- CPC H01L21/304
- CPC H01L21/31053
- CPC H01L22/26
- CPC C01F17/235
- CPC C01P2002/85
- CPC C01P2004/64
- CPC C01P2006/40
- CPC G11B5/7375
- CPC G11B33/08
- CPC C08G73/12
- CPC C08F283/04
- CPC C08J7/0423
- CPC C08K5/14
- CPC C08J2351/08
- CPC C23C16/325
- CPC C23C16/4408
- CPC C23C16/52
- CPC C30B25/16
- CPC C30B25/205
- CPC H01L21/02532
- CPC H01L21/02579
- CPC H01L21/0262
- CPC H10D62/8325
- CPC H10D62/834
- CPC H01L23/3736
- CPC H01L23/145
- CPC H01M4/8668
- CPC H01M8/16
- CPC H01M2250/30
- CPC H01M10/0562
- CPC H01B1/08
- CPC H01M10/0525
- CPC H01M2300/0071
- CPC C09D5/022
- CPC C08F220/18
- CPC C08L33/12
- CPC C09D133/12
- CPC C08L2201/52
- CPC C07C17/23
- CPC C08G65/007
- CPC H01F10/18
- CPC G16C20/70
- CPC H01L21/6836
- CPC H01L2221/68354
- CPC H01L2221/68363
- CPC H01L21/67288
- CPC H01L22/12
- CPC C08G73/1032
- CPC C08F299/022
- CPC C08G73/1021
- CPC H01L21/3212
- CPC C23C14/5806
- CPC G11B5/82
- CPC G11B5/667
- CPC G11B5/855
- CPC H01L24/80
- CPC H01L24/03
- CPC H01L24/08
- CPC H01L2224/03845
- CPC H01L2224/08145
- CPC H01L2224/80895
- CPC H01L2224/80896
- Patent Trends by Company in 2025