DISCO CORPORATION Patent Application Trends in 2024
DISCO CORPORATION Patent Filing Activity
DISCO CORPORATION patent applications in 2024
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Top 10 Technology Areas
- H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses)
- Count: 19 patents
- Example: 20240231608. TOUCH PANEL simplified abstract (DISCO CORPORATION)
- H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {()
- Count: 17 patents
- Example: 20240234154. METHOD OF PROCESSING WAFER simplified abstract (DISCO CORPORATION)
- H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general)
- Count: 13 patents
- Example: 20240105458. DEVICE WAFER PROCESSING METHOD simplified abstract (DISCO CORPORATION)
- H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 10 patents
- Example: 20240128086. METHOD OF PROCESSING WAFER simplified abstract (DISCO CORPORATION)
- H01L21/268 (Bombardment with radiation {()
- H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies)
- B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- Count: 8 patents
- Example: 20240100632. CHIP MANUFACTURING METHOD simplified abstract (DISCO CORPORATION)
- H01L21/3043 ({Making grooves, e.g. cutting})
- Count: 6 patents
- Example: 20240105458. DEVICE WAFER PROCESSING METHOD simplified abstract (DISCO CORPORATION)
- B23K26/0622 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- Count: 6 patents
- Example: 20240181562. LASER PROCESSING APPARATUS simplified abstract (DISCO CORPORATION)
- B23K26/364 (Removing material ()
Emerging Technology Areas
- B24B41/047 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth)
- Count: 1 patents
- Example: 20240042575. WORKPIECE GRINDING METHOD simplified abstract (DISCO CORPORATION)
- B24B37/245 ({Pads with fixed abrasives})
- Count: 1 patents
- Example: 20240042573. POLISHING PAD simplified abstract (DISCO CORPORATION)
- B24B41/06 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth)
- Count: 1 patents
- Example: 20240025001. WORKPIECE GRINDING METHOD simplified abstract (DISCO CORPORATION)
- B24B7/02 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth)
- Count: 1 patents
- Example: 20240025001. WORKPIECE GRINDING METHOD simplified abstract (DISCO CORPORATION)
- B08B13/00 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes)
- Count: 1 patents
- Example: 20240024927. SPINNER UNIT simplified abstract (DISCO CORPORATION)
- B08B3/041 ({Cleaning travelling work})
- Count: 1 patents
- Example: 20240024927. SPINNER UNIT simplified abstract (DISCO CORPORATION)
- H01L21/68721 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks)
- Count: 1 patents
- Example: 20240153777. WAFER PROCESSING METHOD simplified abstract (DISCO CORPORATION)
- H01L21/782 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies)
- Count: 1 patents
- Example: 20240153777. WAFER PROCESSING METHOD simplified abstract (DISCO CORPORATION)
- B28D5/0094 (Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing)
- Count: 1 patents
- Example: 20240149379. MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE simplified abstract (DISCO CORPORATION)
- G02B26/004 (Optical devices or arrangements for the control of light using movable or deformable optical elements (control of light by modification of the optical properties of the media of the elements involved therein)
- Count: 1 patents
- Example: 20240219711. OPTICAL PART ASSEMBLY simplified abstract (DISCO CORPORATION)
Top Inventors
- Hayato IGA (9 patents)
- Hiroshi MORIKAZU (7 patents)
- Kazuya HIRATA (7 patents)
- Naotoshi KIRIHARA (6 patents)
- Yohei KANEKO (5 patents)
- Kentaro ODANAKA (5 patents)
- Shunsuke TERANISHI (4 patents)
- Keiji NOMARU (4 patents)
- Naoko YAMAMOTO (4 patents)
- Kai MINAMIZAKI (3 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- DISCO CORPORATION
- Companies
- CPC B23K26/40
- CPC B23K26/364
- CPC H01L21/268
- CPC B23Q3/084
- CPC B24B1/00
- CPC B24D5/00
- CPC G06F3/04886
- CPC G06F3/0482
- CPC H01L21/67092
- CPC H01L21/304
- CPC H01L24/80
- CPC H01L24/94
- CPC H10B80/00
- CPC H01L2224/80013
- CPC H01L2224/8023
- CPC H01L2224/80894
- CPC H01L2224/80948
- CPC H01L2224/94
- CPC B23K26/082
- CPC B23K26/0665
- CPC B23K2101/42
- CPC B24D15/06
- CPC G01B5/20
- CPC H01L21/6835
- CPC H01L2221/68327
- CPC H01L21/02021
- CPC B23K26/53
- CPC B23K26/035
- CPC H01L21/822
- CPC B23K2101/40
- CPC H01L21/3065
- CPC H01J37/3244
- CPC H01L21/3043
- CPC H01L21/6836
- CPC H01L2221/6834
- CPC B23K26/38
- CPC B23K2103/52
- CPC H01L21/78
- CPC H01L21/8213
- CPC B23K26/0652
- CPC B23K26/702
- CPC G02B1/113
- CPC H01L21/67253
- CPC H01L22/20
- CPC H01L24/32
- CPC H01L24/83
- CPC H01L25/0657
- CPC H01L2224/32145
- CPC H01L2224/83
- CPC B23K26/0626
- CPC B23K26/064
- CPC B23K26/57
- CPC B23K26/0676
- CPC B23K2103/56
- CPC B23Q11/0075
- CPC B23Q11/10
- CPC B24B7/228
- CPC B24B27/0076
- CPC B23K26/0622
- CPC B23K26/0643
- CPC B23K26/0648
- CPC B23K26/067
- CPC B32B7/06
- CPC B32B7/12
- CPC B32B27/08
- CPC B32B27/32
- CPC B32B27/36
- CPC B32B2250/02
- CPC B32B2250/24
- CPC B32B2255/10
- CPC B32B2255/26
- CPC B32B2307/536
- CPC B32B2307/54
- CPC B32B2405/00
- CPC B23K26/1462
- CPC B23Q5/261
- CPC B23Q5/04
- CPC C01B32/28
- CPC B28D5/0011
- CPC H01L23/544
- CPC H01L21/02076
- CPC H01L2223/5446
- CPC H01L2221/68386
- CPC B24D7/14
- CPC B24D7/06
- CPC B24D7/18
- CPC G02B26/0858
- CPC H01L21/6838
- CPC B23K37/04
- CPC C09G1/02
- CPC C09K3/1409
- CPC B24B37/042
- CPC C09G1/04
- CPC H01L21/76251
- CPC H01L21/56
- CPC H01L23/3107
- CPC B23K26/36
- CPC B32B38/0004
- CPC B32B38/0012
- CPC B32B41/00
- CPC H01L22/12
- CPC B32B2038/0016
- CPC B32B2310/0843
- CPC H01L21/0475
- CPC C30B33/08
- CPC B23K26/083
- CPC B23K26/0604
- CPC H01L21/30604
- CPC H01L21/67051
- CPC B24B41/005
- CPC B24B41/068
- CPC B24B51/00
- CPC H01L21/02013
- CPC B23K26/009
- CPC B23K26/16
- CPC B24B37/10
- CPC B24B57/02
- CPC B24B37/013
- CPC B26D5/007
- CPC B26D1/04
- CPC B24B37/14
- CPC B24B37/044
- CPC G01N21/9505
- CPC B23K26/0869
- CPC G01N21/17
- CPC G01N21/8806
- CPC G01N2021/1736
- CPC B24B37/015
- CPC B24D7/10
- CPC B24D3/342
- CPC B24D3/06
- CPC B24D3/14
- CPC B24D3/28
- CPC H01L21/02315
- CPC H01L2221/68381
- CPC B26D1/141
- CPC B26D7/088
- CPC B23K26/354
- CPC B23Q3/15526
- CPC B26D7/00
- CPC B23Q3/15546
- CPC B23Q2003/15537
- CPC B25J11/0095
- CPC B25J19/00
- CPC B25J15/0616
- CPC B25J5/02
- CPC H01L21/7813
- CPC B24B53/12
- CPC H01L21/67155
- CPC H01L21/67242
- CPC H01L21/02016
- CPC H01L21/68764
- CPC H01L21/30655
- CPC H01L21/3081
- CPC B23K26/02
- CPC B23Q3/15503
- CPC G02B26/004
- CPC B28D5/0094
- CPC B24B7/04
- CPC H01L21/782
- CPC H01L21/68721
- CPC B08B3/041
- CPC B08B13/00
- CPC B24B7/02
- CPC B24B41/06
- CPC B24B37/245
- CPC B24B41/047
- Patent Trends by Company in 2024