METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

Abstract: a method for bonding chips includes initially positioning a first bonding head at a first predetermined location relative to an initial position of a substrate chuck, wherein the first bonding head holds a first chip and wherein the substrate chuck supports a bonding surface, initially positioning a second bonding head at a second predetermined location relative to the initial position of the substrate chuck, wherein the second bonding head holds a second chip, alternating between receiving renewed position information of the substrate chuck and repositioning the first bonding head based on the received renewed position information until the first chip contacts the bonding surface, and alternating between receiving renewed position information of the substrate chuck and repositioning the second bonding head based on the received renewed position information until the second chip contacts the bonding surface, and bonding the first chip and the second chip to the bonding surface.

Inventor(s): Nilabh K. Roy, Steven T. Jenkins, Byung-Jin Choi

CPC Classification: H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})

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