SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

This abstract first appeared for US patent application 18647450 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Original Abstract Submitted

A semiconductor package may include a lower structure, and an upper structure on the lower structure. The lower structure may include a first semiconductor substrate, first pads on the first semiconductor substrate, and a first insulating layer enclosing the first pads. The upper structure includes a second semiconductor substrate, second pads on the second semiconductor substrate, and a second insulating layer enclosing the second pads. A side surface of the lower structure and a side surface of the upper structure form a stepwise structure near a bonding surface between the lower structure and the upper structure. The first insulating layer includes a protruding portion that extends to a level higher than a top surface of the first insulating layer and is inserted in the second insulating layer.