18370840. METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS (Tokyo Electron Limited)
METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS
Organization Name
Inventor(s)
Satohiko Hoshino of Koshi City JP
METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS
This abstract first appeared for US patent application 18370840 titled 'METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS
Original Abstract Submitted
Semiconductor devices and corresponding methods of manufacture are disclosed. The methods include forming a first layer on a first substrate, treating the first layer with a nitrogen-based plasma to form a first type of dangling bonds, treating the first layer with an oxygen-based plasma to transform the first type of dangling bonds into a second type of dangling bonds, and treating the first layer with water to transform the second type of dangling bonds into a third type of dangling bonds.