20250167167. Die Stacking Inte (Applied Materials, .)
Die Stacking with Integrated Thermal Treatment
Abstract: methods and apparatus for substrate processing are provided. in some embodiments, a substrate processing method includes: sequentially stacking a plurality of dies on a substrate into a stacked assembly; thermally treating the plurality of dies; and stacking at least one additional die atop the thermally treated plurality of dies.
Inventor(s): Ying WANG, Ke ZHENG, Raymond HUNG, ChangBum YONG, Guan Huei SEE, Gaurav MEHTA
CPC Classification: H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})
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