Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
Organization Name
Inventor(s)
Thomas Sounart of Chandler AZ US
Adel Elsherbini of Chandler AZ US
Michael Baker of Gilbert AZ US
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
This abstract first appeared for US patent application 20250112199 titled 'SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
Original Abstract Submitted
hybrid bonded multi-level die stacks, related apparatuses, systems, and methods of fabrication are disclosed. first-level integrated circuit (ic) dies and a base substrate each include hybrid bonding regions surrounded by hydrophobic structures. the hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the ic die to self-align. a hybrid bond is formed by evaporating the droplet followed by anneal. hybrid bonding regions of second-level ic dies are similarly bonded to hybrid bonding regions on backsides of the first-level ic dies. this is repeated for any number of subsequent levels of ic dies. ic structures including the bonded ic dies and portions of the base substrate are segmented and assembled.