Jump to content

Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

From WikiPatents

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

Organization Name

intel corporation

Inventor(s)

Thomas Sounart of Chandler AZ US

Feras Eid of Chandler AZ US

Adel Elsherbini of Chandler AZ US

Yi Shi of Chandler AZ US

Michael Baker of Gilbert AZ US

Kimin Jun of Portland OR US

Wenhao Li of Chandler AZ US

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

This abstract first appeared for US patent application 20250112199 titled 'SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

Original Abstract Submitted

hybrid bonded multi-level die stacks, related apparatuses, systems, and methods of fabrication are disclosed. first-level integrated circuit (ic) dies and a base substrate each include hybrid bonding regions surrounded by hydrophobic structures. the hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the ic die to self-align. a hybrid bond is formed by evaporating the droplet followed by anneal. hybrid bonding regions of second-level ic dies are similarly bonded to hybrid bonding regions on backsides of the first-level ic dies. this is repeated for any number of subsequent levels of ic dies. ic structures including the bonded ic dies and portions of the base substrate are segmented and assembled.

Cookies help us deliver our services. By using our services, you agree to our use of cookies.