METHOD FOR LOW TEMPERATURE BONDING OF SUBSTRATES

Abstract: a method for low temperature bonding of substrates involves the following steps: a first substrate and a second substrate are provided; the first substrate and the second substrate are aligned; the first substrate and the second substrate are prebonded by a fusion prebonding process; and the first substrate and the second substrate are bonded by applying an electric voltage between the first substrate and the second substrate, wherein said voltage comprises a pulsed or ac component.

Inventor(s): Thomas SCHMIDT

CPC Classification: H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})

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