SYSTEM AND METHOD FOR CLEANING SILICON AND HYDROCARBON CONTACT RESIDUE FROM CHIP SURFACES USING ATMOSPHERIC PLASMA

Abstract: an atmospheric pressure plasma system is used to clean surface contaminants from chip surfaces prior to direct bonding them onto wafers. the surface contaminants include contact residue transferred from common adhesive films and silicone membranes used in semiconductor fabrication and packaging. wca and ftir data confirm the transfer of hydrocarbon and silicone contaminant residue that reduce hydrophilicity and surface energy. the atmospheric plasma treatment of the chip surfaces significantly reduces or eliminates these contaminants and results in stronger bonds than the untreated chip surfaces.

Inventor(s): DANIEL PASCUAL, TAYLOR WUNSCH, LOGAN HARRIS, DAVID MEYER

CPC Classification: H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})

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