Resonac Corporation Patent Application Trends in 2024
Resonac Corporation Patent Filing Activity
Resonac Corporation patent applications in 2024
Top 10 Technology Areas
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- C30B29/36 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,)
- H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 6 patents
- Example: 20240006192. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01M10/0525 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
- C08K2201/001 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives)
- H01M2004/027 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
- C10M107/38 (LUBRICATING COMPOSITIONS (well drilling compositions)
- C10M2213/0606 (LUBRICATING COMPOSITIONS (well drilling compositions)
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 4 patents
- Example: 20240006192. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- C08K3/22 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives)
- H01M2004/021 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
Emerging Technology Areas
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- H05K2201/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/1377 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/0358 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/10553 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H01L2924/1435 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L2224/83815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L2224/81815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L21/566 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L21/82 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components)
- C09J7/38 (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine)
Top Inventors
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- Hajime FUNAHASHI (6 patents)
- Yoshishige OKUNO (5 patents)
- Hikaru SATOH (5 patents)
- Hajime YUKUTAKE (5 patents)
- Kazuyuki MITSUKURA (5 patents)
- Shogo SOBUE (5 patents)
- Saeko OGAWA (5 patents)
- Daisuke IKEDA (5 patents)
- Hiroshi YOKOTA (5 patents)
- Shigeru YAMAKI (4 patents)
Patent Categories
Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
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- Patent Trends by Company in 2024