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Category:G02B6/42
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A
Pages in category "G02B6/42"
The following 81 pages are in this category, out of 81 total.
1
- 17567497. PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17600337. OPTICAL APPARATUS, LIGHT EMITTING APPARATUS, OPTICAL CABLE, AND METHOD OF CONNECTING OPTICAL APPARATUS simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 17703374. Package Structure Including Photonic Package and Interposer Having Waveguide simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17849679. THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17850828. Chip-to-Chip Optical Coupling for Photonic Integrated Circuits simplified abstract (Apple Inc.)
- 17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)
- 17896089. PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17898427. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17945862. Interference Devices for Wavelength Locking simplified abstract (Apple Inc.)
- 17949747. LIGHT GUIDES simplified abstract (HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17959967. METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 17959973. PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT simplified abstract (Applied Materials, Inc.)
- 17960151. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18075302. 3D-TAPERED NANOCAVITIES WITH ON-CHIP OPTICAL AND MOLECULAR CONCENTRATION FOR SINGLE MOLECULE DIAGNOSTICS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149325. LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18153116. Photonic Package and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18213763. RECEIVER, RECEPTION DEVICE, COMMUNICATION DEVICE, AND COMMUNICATION SYSTEM simplified abstract (NEC Corporation)
- 18232342. OPTICAL COUPLING APPARATUS AND METHODS OF MAKING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18252931. Optical Transmitter simplified abstract (Nippon Telegraph and Telephone Corporation)
- 18259451. MOUNTING STRUCTURE OF OPTICAL MODULE AND OPTICAL MOUNTING BOARD simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18315118. OPTIC MULTIPLEXER OR DEMULTIPLEXER simplified abstract (Cisco Technology, Inc.)
- 18379287. Display Device simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18388461. TECHNOLOGIES FOR DYNAMICALLY MANAGING RESOURCES IN DISAGGREGATED ACCELERATORS simplified abstract (Intel Corporation)
- 18455892. OPTO-ELECTRONIC ADAPTER AND COMMUNICATION SYSTEM simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18480121. RECEPTION DEVICE, COMMUNICATION DEVICE, AND COMMUNICATION SYSTEM simplified abstract (NEC Corporation)
- 18488074. METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY simplified abstract (Intel Corporation)
- 18513611. SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518756. OPTICAL ENGINE ASSEMBLY, OPTICAL INTERCONNECTION SYSTEM, AND NETWORK DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18519035. Systems and Methods for Wavelength Locking in Optical Sensing Systems simplified abstract (Apple Inc.)
- 18536662. IMAGE DISPLAY DEVICE AND HEADUP DISPLAY SYSTEM simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18545038. PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM simplified abstract (NEC Corporation)
2
- 20240019649. FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT simplified abstract (Advanced Micro Devices, Inc.)
- 20240027699. TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 20240027706. PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING simplified abstract (Intel Corporation)
- 20240034003. WAVEGUIDE FOR PLASTIC WELDING, ARRANGEMENT FOR PLASTIC WELDING, A WELDING METHOD AS WELL AS A MANUFACTURING METHOD OF A WAVEGUIDE simplified abstract (BRANSON Ultraschall Niederlassung der Emerson Technologies GmbH & Co. OHG)
- 20240077686.Compact Optical Coupler simplified abstract (apple inc.)
- 20240090102.Systems and Methods for Wavelength Locking in Optical Sensing Systems simplified abstract (apple inc.)
A
- Apple inc. (20240103238). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240103301). Head-Mounted Display Device With Vision Correction simplified abstract
- Apple Inc. patent applications on March 14th, 2024
- Apple Inc. patent applications on March 28th, 2024
B
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 28th, 2024
H
I
- Intel corporation (20240111098). METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240113954). TECHNOLOGIES FOR DYNAMICALLY MANAGING RESOURCES IN DISAGGREGATED ACCELERATORS simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 25th, 2024
N
- Nec corporation (20240118507). PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM simplified abstract
- Nec corporation (20240126019). RECEPTION DEVICE, COMMUNICATION DEVICE, AND COMMUNICATION SYSTEM simplified abstract
- NEC Corporation patent applications on April 11th, 2024
- NEC Corporation patent applications on April 18th, 2024
- NEC Corporation patent applications on February 8th, 2024
S
T
- Taiwan semiconductor manufacturing company, ltd. (20240103236). Optical Engine Including Fiber Deflection Unit and Method Forming the Same simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
U
- US Patent Application 17751773. VERTICAL GRATING COUPLER simplified abstract
- US Patent Application 17824923. METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT DEVICE THEREOF simplified abstract
- US Patent Application 17896249. Thermo-Electric Cooler for Dissipating Heat of Optical Engine simplified abstract
- US Patent Application 18031859. OPTICAL CONNECTING STRUCTURE, OPTICAL MODULE AND MANUFACTURING METHOD FOR OPTICAL CONNECTING STRUCTURE simplified abstract
- US Patent Application 18232317. STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PACKAGE BY USING POLYMER WAVEGUIDE simplified abstract
- US Patent Application 18323447. OPTICAL RECEIVER simplified abstract
- US Patent Application 18324483. OPTICAL CONNECTOR MODULE, OPTICAL COUPLING STRUCTURE, CONNECTING MEMBER, AND CONNECTING METHOD simplified abstract
- US Patent Application 18347188. Optical Transceiver and Manufacturing Method Thereof simplified abstract
- US Patent Application 18358790. METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING simplified abstract