US Patent Application 18347188. Optical Transceiver and Manufacturing Method Thereof simplified abstract
Contents
Optical Transceiver and Manufacturing Method Thereof
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Sung-Hui Huang of Dongshan Township (TW)
Kuo-Chiang Ting of Hsinchu (TW)
Shang-Yun Hou of Jubei City (TW)
Optical Transceiver and Manufacturing Method Thereof - A simplified explanation of the abstract
This abstract first appeared for US patent application 18347188 titled 'Optical Transceiver and Manufacturing Method Thereof
Simplified Explanation
The abstract describes a structure that combines a photonic integrated circuit (PIC) die and an electric integrated circuit (EIC) die, along with a semiconductor dam and an insulating encapsulant.
- The structure includes a PIC die with an optical input/output portion and a groove for inserting optical fibers.
- An EIC die is placed over and connected to the PIC die.
- A semiconductor dam is placed over the PIC die.
- An insulating encapsulant is applied over the PIC die, encapsulating the EIC die and the semiconductor dam.
Original Abstract Submitted
A structure including a photonic integrated circuit die, an electric integrated circuit die, a semiconductor dam, and an insulating encapsulant is provided. The photonic integrated circuit die includes an optical input/output portion and a groove located in proximity of the optical input/output portion, wherein the groove is adapted for lateral insertion of at least one optical fiber. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The semiconductor dam is disposed over the photonic integrated circuit die. The insulating encapsulant is disposed over the photonic integrated circuit die and laterally encapsulates the electric integrated circuit die and the semiconductor dam.
