20240019649. FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT simplified abstract (Advanced Micro Devices, Inc.)

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

Organization Name

Advanced Micro Devices, Inc.

Inventor(s)

BRETT P. Wilkerson of AUSTIN TX (US)

RAJA Swaminathan of AUSTIN TX (US)

KONG TOON Ng of HSINCHU (TW)

RAHUL Agarwal of LIVERMORE CA (US)

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240019649 titled 'FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

Simplified Explanation

The patent application describes a semiconductor package that includes a first mold layer partially encasing a photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, providing electrical pathways between the semiconductor chip and the photonic integrated circuit. A second mold layer is then fabricated on the redistribution layer structure, partially encasing the semiconductor chip. Voids are defined in the second mold layer above the optical interface of the photonic integrated circuit, allowing light to transmit through the dielectric material above the interface.

• The semiconductor package includes a mold layer that encases a photonic integrated circuit and a semiconductor chip.
• A redistribution layer structure is fabricated on the mold layer, providing electrical connections between the chip and the photonic integrated circuit.
• A second mold layer is then added, partially encasing the semiconductor chip.
• Voids are defined in the second mold layer above the optical interface of the photonic integrated circuit, allowing light to pass through the dielectric material.

Potential applications of this technology:

• Optical communication systems
• Data centers
• Telecommunications equipment
• Fiber optic networks

Problems solved by this technology:

• Efficient transmission of light signals between the semiconductor chip and the photonic integrated circuit
• Protection of the semiconductor chip and photonic integrated circuit from external elements
• Integration of electrical and optical components in a single package

Benefits of this technology:

• Improved performance and reliability of semiconductor packages
• Enhanced data transmission speed and efficiency
• Compact and cost-effective design
• Simplified manufacturing process

Original Abstract Submitted

a semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. a redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. a second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. the redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. one or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.