20240027699. TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES
Organization Name
Inventor(s)
Nicholas D. Psaila of Lanark (GB)
Pooya Tadayon of Portland OR (US)
TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240027699 titled 'TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES
Simplified Explanation
The abstract of the patent application describes technologies for beam expansion in glass substrates. In the illustrative embodiment, light in a waveguide defined in a glass substrate is allowed to expand towards a curved mirror also defined in the glass substrate. The light is collimated to a beam as it is reflected off the mirror, and in this embodiment, it is reflected upwards toward the top surface of the glass substrate. A photonic integrated circuit (PIC) die can be mounted on the glass substrate, and a micromirror lens fixed to the PIC die can focus the collimated beam into a waveguide defined in the PIC die. Additionally, an interface for an optical connector may be formed in the glass substrate, allowing the optical connector to be removably plugged into the glass substrate.
- Technologies for beam expansion in glass substrates are disclosed.
- Light in a waveguide defined in a glass substrate is allowed to expand towards a curved mirror defined in the glass substrate.
- The light is collimated to a beam as it is reflected off the mirror.
- In the illustrative embodiment, the light is reflected upwards toward the top surface of the glass substrate.
- A photonic integrated circuit (PIC) die can be mounted on the glass substrate.
- A micromirror lens fixed to the PIC die can focus the collimated beam into a waveguide defined in the PIC die.
- An interface for an optical connector may be formed in the glass substrate, allowing the optical connector to be removably plugged into the glass substrate.
Potential Applications
- Optical communication systems
- Fiber optic networks
- Photonic integrated circuits
- Laser technology
Problems Solved
- Efficient beam expansion in glass substrates
- Integration of photonic integrated circuits with glass substrates
- Removable optical connector interface
Benefits
- Improved beam expansion capabilities
- Enhanced integration of photonic integrated circuits with glass substrates
- Flexibility in connecting optical connectors to the glass substrate
Original Abstract Submitted
technologies for beam expansion in glass substrates are disclosed. in the illustrative embodiment, light in a waveguide defined in a glass substrate is allowed to expand towards a curved mirror defined in the glass substrate. the light is collimated to a beam as it is reflected off the mirror. in the illustrative embodiment, the light is reflected upwards toward the top surface of the glass substrate. a photonic integrated circuit (pic) die may be mounted on the glass substrate. a micromirror lens fixed to the pic die can focus the collimated beam into a waveguide defined in the pic die. in some embodiments, an interface for an optical connector may be formed in the glass substrate, allowing the optical connector to be removably plugged into the glass substrate.
