20240027706. PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING simplified abstract (Intel Corporation)

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PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING

Organization Name

Intel Corporation

Inventor(s)

Pooya Tadayon of Portland OR (US)

Eric J. M. Moret of Beaverton OR (US)

Tarek A. Ibrahim of Mesa AZ (US)

David Shia of Portland OR (US)

Nicholas D. Psaila of Lanark (GB)

Russell Childs of Edinburgh (GB)

PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240027706 titled 'PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING

Simplified Explanation

The abstract of this patent application describes an integrated circuit device that includes a substrate, an electronic integrated circuit (EIC), a photonics integrated circuit (PIC) electrically coupled to the EIC, and a glass block located at the end of the substrate within a defined cavity. The glass block contains one or more optical elements that create an optical path to direct light between the PIC and a fiber array unit (FAU) when connected to the glass block.

  • The integrated circuit device includes a substrate, EIC, PIC, and a glass block.
  • The glass block is positioned within a cavity defined by the substrate and located at the end of the substrate.
  • The glass block contains optical elements that enable the directing of light between the PIC and a FAU.
  • The FAU can be attached to the glass block to establish the optical connection.

Potential Applications:

  • Data communication: This technology can be used in data communication systems to enable efficient and reliable transmission of optical signals between integrated circuits and fiber optic networks.
  • Telecommunications: The integration of electronic and photonics circuits can enhance the performance and speed of telecommunications systems, enabling faster data transfer rates and improved connectivity.
  • Optical sensing: The optical elements within the glass block can be utilized in various sensing applications, such as environmental monitoring or biomedical sensing.

Problems Solved:

  • Integration challenges: The integration of electronic and photonics circuits within a compact device can be challenging. This technology solves the problem of efficiently directing light between the PIC and the FAU while maintaining a compact form factor.
  • Signal loss: By providing an optimized optical path, this technology minimizes signal loss during the transmission of light between the PIC and the FAU, ensuring reliable and efficient data transfer.

Benefits:

  • Compact design: The integration of the PIC, EIC, and glass block within a single device allows for a compact and space-efficient solution.
  • Improved performance: The optimized optical path and efficient light transmission result in improved performance, including reduced signal loss and enhanced data transfer rates.
  • Versatility: The technology can be applied to various applications, including data communication, telecommunications, and optical sensing, providing versatility and adaptability to different industries and use cases.


Original Abstract Submitted

in one embodiment, an integrated circuit device includes a substrate, an electronic integrated circuit (eic), a photonics integrated circuit (pic) electrically coupled to the eic, and a glass block at least partially in a cavity defined by the substrate and at an end of the substrate. the glass block defines an optical path with one or more optical elements to direct light between the pic and a fiber array unit (fau) when attached to the glass block.

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