US Patent Application 17896249. Thermo-Electric Cooler for Dissipating Heat of Optical Engine simplified abstract

Thermo-Electric Cooler for Dissipating Heat of Optical Engine

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsing-Kuo Hsia of Jhubei City (TW)

Chih-Kuang Yu of Chiayi City (TW)

Chen-Hua Yu of Hsinchu (TW)

Jui Lin Chao of New Taipei City (TW)

Thermo-Electric Cooler for Dissipating Heat of Optical Engine - A simplified explanation of the abstract

This abstract first appeared for US patent application 17896249 titled 'Thermo-Electric Cooler for Dissipating Heat of Optical Engine

Simplified Explanation

The patent application describes a method for assembling a device that includes a photonic engine and a package component.

• The photonic engine is bonded onto an interposer, which is a substrate that provides electrical connections.
• The package component, which includes a device die, is then bonded onto the interposer.
• The package component and the photonic engine are encapsulated in a protective material.
• A thermal-electronic cooler is attached to the photonic engine to manage heat.
• A metal lid is attached to the package component for further protection.

Original Abstract Submitted

A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.