18513611. SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Ming-Fa Chen of Taichung City (TW)

SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18513611 titled 'SEMICONDUCTOR STRUCTURE

Simplified Explanation

The structure described in the abstract is an optical device that is adapted to be coupled to an optical fiber. Here are some key points to explain the patent/innovation:

• Structure includes a photoelectric integrated circuit die, an electric integrated circuit die, a waveguide die, and an insulating encapsulant.
• Electric integrated circuit die is electrically connected to the photoelectric integrated circuit die.
• Waveguide die is optically coupled to the photoelectric integrated circuit die, with semiconductor pillar portions extending from the optical fiber to the photoelectric integrated circuit die.
• Insulating encapsulant laterally encapsulates the electric integrated circuit die and the waveguide die.

Potential applications of this technology:

• Optical communication systems
• Fiber optic sensors
• Biomedical imaging devices

Problems solved by this technology:

• Efficient optical coupling between optical fibers and integrated circuits
• Improved signal transmission in optical systems

Benefits of this technology:

• Enhanced performance and reliability of optical devices
• Compact and integrated design for space-saving applications
• Facilitates high-speed data transmission in optical communication systems

Original Abstract Submitted

A structure adapted to optical coupled to an optical fiber includes a photoelectric integrated circuit die, an electric integrated circuit die, a waveguide die and an insulating encapsulant. The electric integrated circuit die is over and electrically connected to the photoelectric integrated circuit die. The waveguide die is over and optically coupled to the photoelectric integrated circuit die, wherein the waveguide die includes a plurality of semiconductor pillar portions extending from the optical fiber to the photoelectric integrated circuit die. The insulating encapsulant laterally encapsulates the electric integrated circuit die and the waveguide die.