17959973. PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT simplified abstract (Applied Materials, Inc.)
Contents
- 1 PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT
Organization Name
Inventor(s)
Paul Meissner of San Jose CA (US)
Anup Pancholi of Hillsboro OR (US)
Ronald Huemoeller of Phoenix AZ (US)
PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17959973 titled 'PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT
Simplified Explanation
Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical, and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to form a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-electrical, and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.
- Electronic and photonic integrated circuits
- Fabricating integrated interconnect between electrical, opto-electrical, and photonic devices
- Optical silicon photonic devices
- Opto-electrical integrated circuits
- Co-packaged optical and electrical device
- High volume manufacturing of devices with optical structures on a photonic glass layer substrate
Potential Applications
The technology described in this patent application could be applied in various fields such as telecommunications, data centers, optical networking, and high-speed computing.
Problems Solved
This technology solves the problem of integrating electrical, opto-electrical, and photonic devices seamlessly on a single package substrate, enabling efficient communication and data transfer between different types of devices.
Benefits
The benefits of this technology include improved performance, higher data transfer speeds, reduced power consumption, and compact design due to the integration of multiple functionalities on a single substrate.
Potential Commercial Applications
The potential commercial applications of this technology include optical transceivers, data center interconnects, high-speed communication systems, and integrated photonics for various industries.
Possible Prior Art
One possible prior art in this field is the integration of optical and electrical components on separate substrates, which may not offer the same level of integration and efficiency as the co-packaged approach described in this patent application.
Unanswered Questions
== How does this technology compare to existing methods of integrating optical and electrical devices? This article does not provide a direct comparison with existing methods of integrating optical and electrical devices, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
== What are the potential challenges in scaling up the manufacturing of these integrated devices? The article does not address the potential challenges in scaling up the manufacturing of these integrated devices, leaving room for speculation on the scalability and production issues that may arise.
Original Abstract Submitted
Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to from a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-elctrical and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.
