17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

Organization Name

Intel Corporation

Inventor(s)

Hiroki Tanaka of Gilbert AZ (US)

Robert Alan May of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Changhua Liu of Chandler AZ (US)

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17958002 titled 'MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

Simplified Explanation

The patent application describes microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers. Here are some key points from the abstract:

• Microelectronics packages include an organic substrate, a photonic integrated glass layer, and a glass interposer.
• The organic substrate has through substrate vias.
• The photonic integrated glass layer, with photo detectors, is attached to the organic substrate.
• The glass interposer, with through glass vias, is attached to the organic substrate and is in optical communication with the photo detectors.

Potential Applications

The technology described in the patent application could have potential applications in the following areas:

• High-speed data communication systems
• Optical sensors and detectors
• Integrated photonics devices

Problems Solved

The technology addresses the following problems:

• Improving signal integrity and data transmission speeds in microelectronics packages
• Enhancing optical communication between components in electronic devices
• Increasing the efficiency and reliability of photonic integrated circuits

Benefits

Some of the benefits of this technology include:

• Higher performance and reliability of microelectronics packages
• Enhanced optical communication capabilities in electronic devices
• Improved integration of photonic components in electronic systems

Potential Commercial Applications

The technology could be commercially applied in:

• Telecommunications industry for high-speed data transmission
• Consumer electronics for improved display and camera systems
• Aerospace and defense sector for advanced sensor technologies

Possible Prior Art

One possible prior art could be the use of traditional organic substrates and interposers in microelectronics packaging. However, the integration of photonic integrated glass layers and interposers as described in the patent application may be a novel approach.

Unanswered Questions

How does the manufacturing process of these microelectronics packages compare to traditional methods?

The patent application does not provide detailed information on the manufacturing process involved in producing these packages.

Are there any specific performance metrics or test results provided to demonstrate the advantages of this technology?

The abstract does not mention any specific performance metrics or test results to support the claims of improved signal integrity and optical communication.

Original Abstract Submitted

Disclosed herein are microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers and methods of manufacturing the same. The microelectronics packages may include an organic substrate, a photonic integrated glass layer, and a glass interpose. The organic substrate may define through substrate vias. The photonic integrated glass layer may be attached to the organic substrate. The photonic integrated glass layer may include photo detectors. The glass interposer may be attached to the organic substrate. The glass interposer may define through glass vias in optical communication with the photo detectors.