18153116. Photonic Package and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Photonic Package and Method of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Photonic Package and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 18153116 titled 'Photonic Package and Method of Manufacture
Simplified Explanation
The method described in the patent application involves enhancing the performance of optical devices by depositing a metal layer in an opening in the substrate, which is directly over a grating coupler, and then depositing a second dielectric layer over the metal layer.
- Receiving a workpiece with a substrate, a first dielectric layer, and an optical layer
- Patterning the optical layer to create a waveguide and a grating coupler
- Forming an opening in the substrate to expose the first dielectric layer
- Depositing a metal layer in the opening
- Depositing a second dielectric layer over the metal layer
Potential Applications
This technology could be applied in the development of high-performance optical devices, such as sensors, communication systems, and photonic integrated circuits.
Problems Solved
This method helps improve the efficiency and functionality of optical devices by enhancing the coupling of light into the waveguide through the grating coupler.
Benefits
- Enhanced performance of optical devices - Improved light coupling efficiency - Potential for more compact and efficient optical systems
Original Abstract Submitted
A method includes receiving a workpiece that includes a substrate, a first dielectric layer over the substrate, and an optical layer over the dielectric layer; patterning the optical layer to form a first waveguide and a grating coupler; forming a first opening in the substrate that exposes the first dielectric layer, wherein at least a portion of the first opening is directly over the grating coupler; depositing a metal layer in the first opening; and depositing a second dielectric layer over the metal layer.
