17959967. METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES simplified abstract (Applied Materials, Inc.)
Contents
- 1 METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES
Organization Name
Inventor(s)
Paul Meissner of San Jose CA (US)
Anup Pancholi of Hillsboro OR (US)
Ronald Huemoeller of Phoenix AZ (US)
METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17959967 titled 'METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES
Simplified Explanation
Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical, and photonic devices. One or more optical silicon photonic devices may be used in connection with opto-electrical integrated circuits on a single package substrate to form a co-packaged optical and electrical device. The methods enable high-volume manufacturing of devices with optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.
- Electronic and photonic integrated circuits
- Fabricating integrated interconnect between electrical, opto-electrical, and photonic devices
- Optical silicon photonic devices
- Co-packaged optical and electrical devices
- High-volume manufacturing of devices with optical structures
Potential Applications
This technology could be applied in:
- Data centers
- Telecommunications networks
- Optical communication systems
Problems Solved
- Integration of optical and electrical components
- High-volume manufacturing of complex devices
- Efficient interconnect between different types of devices
Benefits
- Improved performance of integrated circuits
- Cost-effective manufacturing processes
- Enhanced functionality of electronic and photonic devices
Potential Commercial Applications
- Optical transceivers
- Fiber optic networks
- High-speed data transmission systems
Possible Prior Art
One possible prior art could be the integration of optical and electrical components in a single package substrate, but the specific methods and structures described in this patent application may be novel and inventive.
Unanswered Questions
How does this technology compare to existing methods of integrating optical and electrical components?
This article does not provide a direct comparison to existing methods of integrating optical and electrical components.
What are the specific manufacturing challenges that this technology addresses?
The article does not delve into the specific manufacturing challenges that this technology addresses.
Original Abstract Submitted
Embodiments described herein also relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to from a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-electrical and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.
