17850828. Chip-to-Chip Optical Coupling for Photonic Integrated Circuits simplified abstract (Apple Inc.)
Contents
Chip-to-Chip Optical Coupling for Photonic Integrated Circuits
Organization Name
Inventor(s)
Jeremy D. Witmer of San Jose CA (US)
Alfredo Bismuto of Sunnyvale CA (US)
Jeffrey T. Hill of Los Altos CA (US)
Junkyo Suh of Santa Clara CA (US)
Yigit O. Yilmaz of San Francisco CA (US)
Chip-to-Chip Optical Coupling for Photonic Integrated Circuits - A simplified explanation of the abstract
This abstract first appeared for US patent application 17850828 titled 'Chip-to-Chip Optical Coupling for Photonic Integrated Circuits
Simplified Explanation
Abstract: A photonic integrated circuit can be manufactured by combining multiple elements formed by different processes onto separate chips. This is achieved by defining complementary geometries on each chip using photolithography processes. The chips are then aligned and engaged, resulting in the optical and mechanical intercoupling of the chips to create a single photonic integrated circuit.
Patent/Innovation:
- Photonic integrated circuit manufacturing process
- Combining multiple elements formed by different processes onto separate chips
- Defining complementary geometries on each chip using photolithography processes
- Aligning and engaging the chips to optically and mechanically intercouple them
- Creating a single photonic integrated circuit
Potential Applications:
- Telecommunications
- Data centers
- Optical computing
- Sensing and imaging systems
- Quantum computing
Problems Solved:
- Simplifies the manufacturing process of photonic integrated circuits
- Enables the integration of multiple elements formed by different processes
- Provides a method for aligning and engaging separate chips to create a single circuit
Benefits:
- Increased efficiency and performance of photonic integrated circuits
- Cost-effective manufacturing process
- Enables the development of compact and high-density photonic integrated circuits
- Facilitates the integration of various functionalities onto a single chip
Original Abstract Submitted
A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.
