There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L21/31116
Pages in category "CPC H01L21/31116"
The following 88 pages are in this category, out of 88 total.
1
- 17969368. MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH simplified abstract (Applied Materials, Inc.)
- 18210918. METHODS OF SELECTIVELY ETCHING SILICON NITRIDE (Applied Materials, Inc.)
- 18236042. METHODS OF ETCHING SILICON-AND-OXYGEN-CONTAINING FEATURES AT LOW TEMPERATURES (Applied Materials, Inc.)
- 18296503. MULTI LEVEL CONTACT ETCH simplified abstract (Tokyo Electron Limited)
- 18376053. LINE EDGE ROUGHNESS (LER) IMPROVEMENT OF RESIST PATTERNS (Applied Materials, Inc.)
- 18395879. ETCHING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18453843. Etch Selectivity Modulation by Fluorocarbon Treatment (Tokyo Electron Limited)
- 18482401. SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18705932. MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLASMA ETCHING (LAM RESEARCH CORPORATION)
- 18749528. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18826923. METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM (Kokusai Electric Corporation)
- 18865846. REDUCED TEMPERATURE ETCHING OF DOPED SILICON OXIDE (Lam Research Corporation)
- 18896372. ETCHING METHOD (Hitachi High-Tech Corporation)
- 18964049. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- 18971817. MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE (SK hynix Inc.)
- 19017838. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
2
- 20250174464. Method Devi (CENTRAL GLASS , LIMITED)
- 20250183051. Selective Precision E (Lam Research)
- 20250183052. Processing Method P (Tokyo Electron Limited)
- 20250218788. Substrate Stress Manag (Applied Materials, .)
- 20250218789. Substrate Processing Method (TES .,)
- 20250232983. Etching Method, (CENTRAL GLASS , LIMITED)
A
- AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION Patent Application Trends in 2024
- Applied materials, inc. (20240420962). METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Applied materials, inc. (20250069895). METHODS OF ETCHING SILICON-AND-OXYGEN-CONTAINING FEATURES AT LOW TEMPERATURES
- Applied materials, inc. (20250112056). LINE EDGE ROUGHNESS (LER) IMPROVEMENT OF RESIST PATTERNS
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 27th, 2025
C
H
I
K
L
R
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- SEMES CO., LTD. Patent Application Trends in 2024
- Shin-Etsu Chemical Co., Ltd. Patent Application Trends in 2024
- SK hynix Inc. Patent Application Trends in 2025
- STMicroelectronics (Tours) SAS Patent Application Trends in 2024
- STMicroelectronics International N.V. Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240339329). GAS PHASE TREATMENT FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- Tokyo electron limited (20240339328). MULTI LEVEL CONTACT ETCH simplified abstract
- Tokyo electron limited (20250149342). ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- Tokyo Electron Limited patent applications on February 6th, 2025
- Tokyo Electron Limited patent applications on March 6th, 2025
- Tokyo Electron Limited patent applications on May 8th, 2025
- Tokyo Electron Limited patent applications on October 10th, 2024