SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
SAMSUNG ELECTRONICS CO.,LTD. Patent Filing Activity
SAMSUNG ELECTRONICS CO.,LTD. patent applications in 2024
Top 10 Technology Areas
- G06F8/65 (Updates (security arrangements therefor)
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 3 patents
- Example: 20240055364. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co.,Ltd.)
- H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 3 patents
- Example: 20240055364. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co.,Ltd.)
- H04L25/061 (Dc level restoring means; Bias distortion correction {; Decision circuits providing symbol by symbol detection})
- H04L25/03885 (Shaping networks in transmitter or receiver, e.g. adaptive shaping networks)
- H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes)
- Count: 2 patents
- Example: 20240055364. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co.,Ltd.)
- H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({)
- Count: 2 patents
- Example: 20240055364. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co.,Ltd.)
- H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 2 patents
- Example: 20240055364. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co.,Ltd.)
- G06F3/038 (Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry)
- G06F3/041 (Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means)
Emerging Technology Areas
- H03M13/036 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means)
- H03M13/6552 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means)
- H03M13/2906 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means)
- H03M13/255 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means)
- H03M13/1165 (CODING; DECODING; CODE CONVERSION IN GENERAL (using fluidic means)
- H05K2201/099 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240032188. SUBSTRATE simplified abstract (Samsung Electronics Co.,Ltd.)
- H05K1/142 (Structural association of two or more printed circuits (providing electric connection to or between printed circuits)
- Count: 1 patents
- Example: 20240032188. SUBSTRATE simplified abstract (Samsung Electronics Co.,Ltd.)
- H05K1/0269 ({Spark gaps})
- Count: 1 patents
- Example: 20240032188. SUBSTRATE simplified abstract (Samsung Electronics Co.,Ltd.)
- G11C16/16 (STATIC STORES (semiconductor memory devices)
- G11C16/10 (Programming or data input circuits)
Top Inventors
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- Seungsik EOM (2 patents)
- Youngjin CHUNG (2 patents)
- Sangyun HWANG (2 patents)
- Byeongwook YOO (1 patent)
- Saksham GOYAL (1 patent)
- Sourabh TIWARI (1 patent)
- Vinay Vasanth PATAGE (1 patent)
- Zhou SI (1 patent)
- Fan SHEN (1 patent)
- Ning Li (1 patent)
Patent Categories
Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
SAMSUNG ELECTRONICS CO.,LTD. Inventor States 2024 - Up to June 2024
Categories:
- Pages with broken file links
- SAMSUNG ELECTRONICS CO.,LTD.
- Companies
- CPC H04L25/061
- CPC G06F8/65
- CPC H04L25/03885
- CPC G06F3/038
- CPC G06F3/041
- CPC G06V40/13
- CPC G06V40/1365
- CPC G06F2203/0331
- CPC G06F2203/0384
- CPC G06F9/466
- CPC G06F8/71
- CPC G01S17/894
- CPC G01S17/04
- CPC G01S7/4865
- CPC H04N9/3185
- CPC H04N9/3182
- CPC H04N9/3194
- CPC H04N23/841
- CPC H04N25/10
- CPC H01L23/544
- CPC H01L23/3121
- CPC H01L23/5386
- CPC H01L23/5384
- CPC H01L25/0657
- CPC H01L24/16
- CPC H01L2225/06517
- CPC H01L2224/16225
- CPC G06N3/04
- CPC G06F3/0338
- CPC H04N21/4221
- CPC G06F3/0482
- CPC G06F3/0234
- CPC G06F3/04842
- CPC G06F3/04895
- CPC H04N21/42204
- CPC H01L23/49822
- CPC H01L21/565
- CPC H01L24/48
- CPC H01L23/3128
- CPC H01L25/105
- CPC H01L24/73
- CPC H01L23/5389
- CPC H01L2225/06513
- CPC H01L2225/1058
- CPC H01L2224/48227
- CPC H01L2224/73204
- CPC H01L2224/73265
- CPC H01L2223/54433
- CPC H01L24/81
- CPC H01L23/562
- CPC H01L2224/81801
- CPC H01L2924/3511
- CPC H10B12/50
- CPC H10B12/09
- CPC H10B12/315
- CPC H01J37/32642
- CPC H01J37/32449
- CPC H01J37/32724
- CPC H01L21/3065
- CPC H01L21/31116
- CPC H01L21/31144
- CPC H01J2237/334
- CPC H01L23/5283
- CPC H01L23/5226
- CPC H10B43/10
- CPC H10B43/27
- CPC H10B43/35
- CPC H10B41/10
- CPC H10B41/27
- CPC H10B41/35
- CPC H10B80/00
- CPC H01L25/0652
- CPC H01L2225/06541
- CPC G11C16/3409
- CPC G11C11/5628
- CPC G11C11/5635
- CPC G11C11/5671
- CPC G11C16/0483
- CPC G11C16/10
- CPC G11C16/16
- CPC H05K1/0269
- CPC H05K1/142
- CPC H05K2201/099
- CPC H03M13/1165
- CPC H03M13/255
- CPC H03M13/2906
- CPC H03M13/6552
- CPC H03M13/036
- Patent Trends by Company in 2024