United Semiconductor (Xiamen) Co., Ltd. Patent Application Trends in 2025
United Semiconductor (Xiamen) Co., Ltd. Patent Filing Activity
United Semiconductor (Xiamen) Co., Ltd. patent applications in 2025
_Co.,_Ltd._Monthly_Patent_Applications_2025_-_Up_to_March_2025.png)
Top 10 Technology Areas
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- H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate})
- C23C14/3414 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
- C23C14/14 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
- H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L29/6656 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides)
- H10N70/8418 (No explanation available)
- H10B63/00 (Resistance change memory devices, e.g. resistive RAM [ReRAM] devices)
- H10N70/011 (No explanation available)
- H10N70/24 (No explanation available)
- H10N70/8833 (No explanation available)
Emerging Technology Areas
_Co.,_Ltd._Top_Emerging_Technology_Areas_2025_-_Up_to_March_2025.png)
- H01J2237/334 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps)
- Count: 1 patents
- Example: 20250087466. PROCESSING APPARATUS AND PROCESSING METHOD (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/6833 (for supporting or gripping (for conveying)
- Count: 1 patents
- Example: 20250087466. PROCESSING APPARATUS AND PROCESSING METHOD (United Semiconductor (Xiamen) Co., Ltd.)
- H01J37/32834 (Gas-filled discharge tubes (heating by discharge)
- Count: 1 patents
- Example: 20250087466. PROCESSING APPARATUS AND PROCESSING METHOD (United Semiconductor (Xiamen) Co., Ltd.)
- H01J37/32715 (Gas-filled discharge tubes (heating by discharge)
- Count: 1 patents
- Example: 20250087466. PROCESSING APPARATUS AND PROCESSING METHOD (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/76877 ({Thin films associated with contacts of capacitors})
- Count: 1 patents
- Example: 20250031433. METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/76829 ({characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers})
- Count: 1 patents
- Example: 20250031433. METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/2855 (from a gas or vapour, e.g. condensation)
- Count: 1 patents
- Example: 20250031433. METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/823828 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components)
- Count: 1 patents
- Example: 20250031433. METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon)
- Count: 1 patents
- Example: 20250095994. METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE (United Semiconductor (Xiamen) Co., Ltd.)
- H01L21/266 (using masks {()
- Count: 1 patents
- Example: 20250095994. METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE (United Semiconductor (Xiamen) Co., Ltd.)
Top Inventors
_Co.,_Ltd._Top_Inventors_2025_-_Up_to_March_2025.png)
- Wen Yi Tan (7 patents)
- Chin-Chun Huang (3 patents)
- Yongbo Xu (2 patents)
- Shouguo Zhang (2 patents)
- Ching-Shu Lo (2 patents)
- WEN YI TAN (2 patents)
- Hailong Gu (2 patents)
- Wei-Chun Chang (1 patent)
- You-Di Jhang (1 patent)
- Han-Min Huang (1 patent)
Patent Categories
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Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
United Semiconductor (Xiamen) Co., Ltd. Inventor States 2025 - Up to March 2025
_Co.,_Ltd._Inventor_States_2025_-_Up_to_March_2025.png){kind=link}
Categories:
- Pages with broken file links
- United Semiconductor (Xiamen) Co., Ltd.
- Companies
- CPC C23C14/3414
- CPC C23C14/14
- CPC H01L29/66545
- CPC H01L29/0847
- CPC H01L29/6656
- CPC H10N70/8418
- CPC H10B63/00
- CPC H10N70/011
- CPC H10N70/24
- CPC H10N70/8833
- CPC G03F7/091
- CPC G03F7/162
- CPC H10D30/027
- CPC H01L21/0217
- CPC H01L21/02211
- CPC H01L21/02271
- CPC H01L21/02318
- CPC H01L21/31116
- CPC H01L21/31111
- CPC H01L21/823814
- CPC H01L21/823864
- CPC H01L21/82385
- CPC H01L21/266
- CPC H01L21/76224
- CPC H01L21/823828
- CPC H01L21/2855
- CPC H01L21/76829
- CPC H01L21/76877
- CPC H01J37/32715
- CPC H01J37/32834
- CPC H01L21/6833
- CPC H01J2237/334
- Patent Trends by Company in 2025