20250218788. Substrate Stress Manag (Applied Materials, .)
SUBSTRATE STRESS MANAGEMENT USING DIRECT SELECTIVE AREA PROCESSING
Abstract: a method may include providing a stress the substrate having a main surface, and forming a patterned stress compensation layer on the main surface, wherein the patterned stress compensation layer is formed by exposing the main surface to a processing beam while a movement of the ion beam with respect to the main surface takes place.
Inventor(s): Morgan EVANS
CPC Classification: H01L21/31116 ({by dry-etching})
Search for rejections for patent application number 20250218788