20240083040.SUBSTRATE PROCESSING DEVICE AND METHOD OF CONTROLLING THE SAME simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SUBSTRATE PROCESSING DEVICE AND METHOD OF CONTROLLING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING DEVICE AND METHOD OF CONTROLLING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING DEVICE AND METHOD OF CONTROLLING THE SAME
Organization Name
Inventor(s)
SUBSTRATE PROCESSING DEVICE AND METHOD OF CONTROLLING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240083040 titled 'SUBSTRATE PROCESSING DEVICE AND METHOD OF CONTROLLING THE SAME
Simplified Explanation
The patent application describes a method of controlling a substrate processing device by aligning a door opener with a door, detaching the door from the substrate carrier, exposing the entrance of the substrate carrier, removing substrates from the carrier, and aligning the door opener to the entrance for further substrate removal.
- Align door opener with front side of door
- Couple door opener to door
- Detach door from substrate carrier
- Lower door opener to expose entrance of substrate carrier
- Remove substrates from carrier
- Align door opener to entrance of substrate carrier
- Lower door opener in perpendicular direction to remove another substrate
Potential Applications
This technology could be applied in semiconductor manufacturing processes, clean room environments, and other industries where precise substrate handling is required.
Problems Solved
This technology solves the problem of efficiently and accurately removing substrates from a substrate carrier without causing damage or contamination.
Benefits
The benefits of this technology include improved substrate handling efficiency, reduced risk of damage to substrates, and increased overall productivity in substrate processing operations.
Potential Commercial Applications
Potential commercial applications for this technology include semiconductor fabrication facilities, electronics manufacturing plants, and any industry requiring precise substrate handling processes.
Possible Prior Art
One possible prior art for this technology could be automated substrate handling systems used in semiconductor manufacturing facilities. These systems may have similar features for aligning and removing substrates from carriers.
Unanswered Questions
How does this technology impact the overall efficiency of substrate processing operations?
This technology improves efficiency by streamlining the substrate removal process and reducing the risk of errors or damage.
What are the potential cost savings associated with implementing this technology?
By reducing the risk of substrate damage and improving overall productivity, this technology can lead to cost savings in substrate processing operations.
Original Abstract Submitted
a method of controlling a substrate processing device includes aligning a door opener with a front side of a door, wherein the door has closed an entrance of a substrate carrier, coupling the door opener to the door, detaching the door from the substrate carrier after the coupling of the door opener to the door, lowering the door opener coupled to the door and exposing the entrance of the substrate carrier, taking out one of a plurality of substrates from the substrate carrier, aligning the door opener coupled to the door to be adjacent to a front side of the entrance of the substrate carrier, the door coupled with the door opener being inclined at an inclination angle with respect to the entrance, lowering the door opener coupled to the door in a second direction perpendicular to the first direction, and taking another substrate out of the substrate carrier.
