20240085812.SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Kyeongbeom Park of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240085812 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The patent application describes a substrate processing apparatus with a chamber for processing a substrate, a light source to harden a photoresist pattern on the substrate, and a transparent division part separating the light source from the substrate within the chamber.
- The substrate processing apparatus includes a chamber with an internal space for processing a substrate.
- A light source is used to emit light on the substrate to harden a photoresist pattern on it.
- A transparent division part divides the chamber into a space for the light source and a space for the substrate.
Potential Applications
This technology can be used in semiconductor manufacturing processes, photolithography, and other industries requiring precise substrate processing.
Problems Solved
This technology solves the problem of accurately and efficiently hardening photoresist patterns on substrates without interference or contamination.
Benefits
The benefits of this technology include improved accuracy, efficiency, and quality in substrate processing, leading to higher yields and reduced production costs.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, research institutions, and companies involved in microelectronics manufacturing.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus with a different configuration or design.
Unanswered Questions
How does the transparent division part prevent contamination between the light source and the substrate during processing?
The transparent division part acts as a barrier between the light source and the substrate, ensuring that no particles or contaminants from the light source can reach the substrate during processing.
What is the specific wavelength of light emitted by the light source to harden the photoresist pattern on the substrate?
The specific wavelength of light emitted by the light source is optimized to effectively harden the photoresist pattern on the substrate without causing damage or overheating.
Original Abstract Submitted
a substrate processing apparatus includes a chamber having an internal space configured to process a substrate loaded therein; a light source configured to emit light on the substrate to harden a photoresist pattern coated on the substrate; and a transparent division part provided between the substrate and the light source, wherein the transparent division part divides the chamber into a first space, in which the light source is provided, and a second space, in which the substrate is provided.
