20240085891.VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS simplified abstract (samsung electronics co., ltd.)
Contents
- 1 VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS
Organization Name
Inventor(s)
VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240085891 titled 'VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS
Simplified Explanation
The abstract describes a virtual metrology method for predicting the physical characteristics of a target wafer based on the process path information and measured values of sample wafers.
- Collect log data with process path information of manufactured wafers.
- Measure physical characteristics of sample wafers.
- Classify measured values of sample wafers based on process paths.
- Calculate moving average values for each process path.
- Determine moving average value for the target wafer as a predicted value.
Potential Applications
This technology can be applied in semiconductor manufacturing processes to predict the physical characteristics of wafers without the need for direct measurement.
Problems Solved
1. Eliminates the need for direct measurement of target wafers, saving time and resources. 2. Provides accurate predictions of physical characteristics based on historical data and process paths.
Benefits
1. Improved efficiency in wafer manufacturing processes. 2. Enhanced quality control through predictive analysis. 3. Cost savings by reducing the need for physical measurements.
Potential Commercial Applications
Predictive metrology technology can be utilized in semiconductor manufacturing companies to optimize production processes and ensure consistent quality of wafers.
Possible Prior Art
One possible prior art could be traditional metrology methods that rely on direct measurements of physical characteristics of wafers, which may be time-consuming and costly.
Unanswered Questions
How does this technology impact the overall yield of semiconductor manufacturing processes?
This technology can potentially increase the yield by providing accurate predictions of physical characteristics, allowing for timely adjustments in the manufacturing process to avoid defects.
What are the limitations of virtual metrology compared to traditional direct measurement methods?
Virtual metrology may have limitations in predicting certain complex physical characteristics that require direct measurement techniques for accurate results.
Original Abstract Submitted
a virtual metrology method for a wafer includes collecting log data including process path information of wafers manufactured in a semiconductor process; collecting measured values of sample wafers of which physical characteristics are measured in the semiconductor process, the sample wafers being a group of wafers selected from among the manufactured wafers; classifying measured values of the sample wafers according to process paths based on the process path information; calculating a moving average value of measured values classified for each process path; and determining a moving average value corresponding to a process path of an unmeasured target wafer from among the manufactured wafers as a predicted value of the physical characteristics of the target wafer.
