Intel Corporation patent applications published on October 26th, 2023
Summary of the patent applications from Intel Corporation on October 26th, 2023
Intel Corporation has recently filed patents for various technologies and systems. These include compact heat exchangers for server chassis, microelectronic assemblies with sloped sidewall conductive traces, a technology for supporting two timing advances in a cellular network, a system for managing multiple access points, an apparatus for processing microservice functional calls, devices for secure information transfer, the use of edge computing environments and Functions-as-a-Service (FaaS), a technology for migrating cloud-based workloads, a system for interpreting policies based on device attributes, and a microelectronic device with radio frequency components.
Notable applications:
- Compact heat exchangers for server chassis
- Microelectronic assemblies with sloped sidewall conductive traces
- Technology for supporting two timing advances in a cellular network
- System for managing multiple access points
- Apparatus for processing microservice functional calls
- Devices for secure information transfer
- Use of edge computing environments and Functions-as-a-Service (FaaS)
- Technology for migrating cloud-based workloads
- System for interpreting policies based on device attributes
- Microelectronic device with radio frequency components.
Contents
- 1 Patent applications for Intel Corporation on October 26th, 2023
- 1.1 CURRENT SENSING IN NON-CMOS SEMICONDUCTOR TECHNOLOGY FOR POWER CONVERSION APPLICATIONS (17727153)
- 1.2 COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC) (17725090)
- 1.3 PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS (17729974)
- 1.4 THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC INTEGRATED CIRCUIT (PIC) (17725018)
- 1.5 REAL TIME HOLOGRAPHY USING LEARNED ERROR FEEDBACK (18308447)
- 1.6 METHODS AND APPARATUS FOR AUTONOMOUS MOBILE ROBOTS (18343607)
- 1.7 METHOD AND APPARATUS TO IMPROVE BANDWIDTH EFFICIENCY IN A DYNAMIC RANDOM ACCESS MEMORY (18215907)
- 1.8 INTEGRATED CIRCUITS WITH MACHINE LEARNING EXTENSIONS (18216797)
- 1.9 METHOD AND APPARATUS FOR HOT UPGRADE OR LIVE RECOVERY OF STORAGE BACKEND SOFTWARE BASED ON IPU OR DPU (18214999)
- 1.10 APPARATUSES AND METHODS FOR SPECULATIVE EXECUTION SIDE CHANNEL MITIGATION (18138591)
- 1.11 METHODS AND APPARATUS TO OPTIMIZE WORKFLOWS (18301755)
- 1.12 HARDWARE-BASED GENERATION OF UNCOMPRESSED DATA BLOCKS (18214830)
- 1.13 METHODS AND APPARATUS FOR A REMOTE PROCESSING ACCELERATION ENGINE (18345497)
- 1.14 SYSTEM MANAGEMENT MODE (SMM) ERROR HANDLER (17724811)
- 1.15 MULTISYSTEM SHARED MEMORY (18215535)
- 1.16 Circuit Systems And Methods For Transmitting Signals Between Devices (18216867)
- 1.17 Systems And Methods For Load Balancing Memory Traffic (18215732)
- 1.18 Efficient Triangular Systolic Array-Based Matrix Inversion (18217011)
- 1.19 HARDWARE ATTESTATION IN A MULTI-NETWORK INTERFACE DEVICE SYSTEM (18215752)
- 1.20 LIGHTWEIGHT ELECTRONIC CONTROL UNIT FINGERPRINTING (18215924)
- 1.21 TECHNIQUES TO MITIGATE CACHE-BASED SIDE-CHANNEL ATTACKS (18214870)
- 1.22 PLATFORM SECURITY MECHANISM (18339571)
- 1.23 METHODS AND APPARATUS FOR PROFILE-GUIDED OPTIMIZATION OF INTEGRATED CIRCUITS (18311886)
- 1.24 LEARNING NEURAL REFLECTANCE SHADERS FROM IMAGES (17849055)
- 1.25 CONSTANT-BASED CALCULATIONS IN SHADER PROLOGUE SHARED FUNCTION (18025866)
- 1.26 ADAPTIVE MULTISAMPLING BASED ON VERTEX ATTRIBUTES (18306668)
- 1.27 INPUT IMAGE SIZE SWITCHABLE NETWORK FOR ADAPTIVE RUNTIME EFFICIENT IMAGE CLASSIFICATION (17918080)
- 1.28 NOR GATE BASED LOCAL ACCESS LINE DESELECT SIGNAL GENERATION (17725384)
- 1.29 SELF-RESETTING CLOCK GENERATOR (17728256)
- 1.30 MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF INTEGRATED CIRCUIT STRUCTURES (18216984)
- 1.31 SIZE AND EFFICIENCY OF DIES (18216989)
- 1.32 MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS (18216102)
- 1.33 SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE (18216005)
- 1.34 CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE (18214742)
- 1.35 MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (18346321)
- 1.36 FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD (18217000)
- 1.37 PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (17728147)
- 1.38 TECHNIQUES FOR DIE TILING (18216275)
- 1.39 INTEGRATED CIRCUIT STRUCTURES WITH SOURCE OR DRAIN DOPANT DIFFUSION BLOCKING LAYERS (18216563)
- 1.40 MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS (18216282)
- 1.41 METHODS AND APPARATUS TO AUTONOMOUSLY IMPLEMENT POLICIES AT THE EDGE (18344714)
- 1.42 METHODS AND APPARATUS TO INCREASE PRIVACY FOR FOLLOW-ME SERVICES (18343671)
- 1.43 SECURE AND ATTESTABLE FUNCTIONS-AS-A-SERVICE (18216412)
- 1.44 METHODS AND APPARATUS FOR SECURED INFORMATION TRANSFER (18345865)
- 1.45 PACKET BASED IN-LINE PROCESSING FOR DATA CENTER ENVIRONMENTS (18216524)
- 1.46 ENHANCED MAPPING MECHANISM FOR TRANSMISSION IDENTIFIER TO LINK IN NON-COLLOCATED ACCESS POINT MULTI-LINK DOWNLINK SYSTEMS (18341551)
- 1.47 RELEASE-18 (REL-18) SUPPORT OF TWO TIMING ADVANCES (TAS) FOR SINGLE CELL (18307484)
- 1.48 MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFERENT THICKNESSES (18344944)
- 1.49 COMPACT REAR MOUNTED HEAT EXCHANGERS AND RELATED METHODS (18344620)
Patent applications for Intel Corporation on October 26th, 2023
CURRENT SENSING IN NON-CMOS SEMICONDUCTOR TECHNOLOGY FOR POWER CONVERSION APPLICATIONS (17727153)
Main Inventor
Nachiket Desai
COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC) (17725090)
Main Inventor
Chia-Pin Chiu
PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS (17729974)
Main Inventor
Brandon C. MARIN
THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC INTEGRATED CIRCUIT (PIC) (17725018)
Main Inventor
Chia-Pin Chiu
REAL TIME HOLOGRAPHY USING LEARNED ERROR FEEDBACK (18308447)
Main Inventor
Alexey Supikov
METHODS AND APPARATUS FOR AUTONOMOUS MOBILE ROBOTS (18343607)
Main Inventor
Akhilesh S. Thyagaturu
METHOD AND APPARATUS TO IMPROVE BANDWIDTH EFFICIENCY IN A DYNAMIC RANDOM ACCESS MEMORY (18215907)
Main Inventor
Todd A. HINCK
INTEGRATED CIRCUITS WITH MACHINE LEARNING EXTENSIONS (18216797)
Main Inventor
Martin Langhammer
METHOD AND APPARATUS FOR HOT UPGRADE OR LIVE RECOVERY OF STORAGE BACKEND SOFTWARE BASED ON IPU OR DPU (18214999)
Main Inventor
Jun ZENG
APPARATUSES AND METHODS FOR SPECULATIVE EXECUTION SIDE CHANNEL MITIGATION (18138591)
Main Inventor
Jason W. Brandt
METHODS AND APPARATUS TO OPTIMIZE WORKFLOWS (18301755)
Main Inventor
Thijs Metsch
HARDWARE-BASED GENERATION OF UNCOMPRESSED DATA BLOCKS (18214830)
Main Inventor
Laurent Coquerel
METHODS AND APPARATUS FOR A REMOTE PROCESSING ACCELERATION ENGINE (18345497)
Main Inventor
Thomas E. Willis
SYSTEM MANAGEMENT MODE (SMM) ERROR HANDLER (17724811)
Main Inventor
Pannerkumar Rajagopal
MULTISYSTEM SHARED MEMORY (18215535)
Main Inventor
Timothy WITHAM
Circuit Systems And Methods For Transmitting Signals Between Devices (18216867)
Main Inventor
Md Altaf Hossain
Systems And Methods For Load Balancing Memory Traffic (18215732)
Main Inventor
Przemek Guzy
Efficient Triangular Systolic Array-Based Matrix Inversion (18217011)
Main Inventor
Tolga Ayhan
HARDWARE ATTESTATION IN A MULTI-NETWORK INTERFACE DEVICE SYSTEM (18215752)
Main Inventor
Eoin WALSH
LIGHTWEIGHT ELECTRONIC CONTROL UNIT FINGERPRINTING (18215924)
Main Inventor
Eduardo Alban
TECHNIQUES TO MITIGATE CACHE-BASED SIDE-CHANNEL ATTACKS (18214870)
Main Inventor
Marcel CORNU
PLATFORM SECURITY MECHANISM (18339571)
Main Inventor
Michael Berger
METHODS AND APPARATUS FOR PROFILE-GUIDED OPTIMIZATION OF INTEGRATED CIRCUITS (18311886)
Main Inventor
Byron Sinclair
LEARNING NEURAL REFLECTANCE SHADERS FROM IMAGES (17849055)
Main Inventor
Benjamin Ummenhofer
CONSTANT-BASED CALCULATIONS IN SHADER PROLOGUE SHARED FUNCTION (18025866)
Main Inventor
Przemyslaw SZYMANSKI
ADAPTIVE MULTISAMPLING BASED ON VERTEX ATTRIBUTES (18306668)
Main Inventor
Prasoonkumar Surti
INPUT IMAGE SIZE SWITCHABLE NETWORK FOR ADAPTIVE RUNTIME EFFICIENT IMAGE CLASSIFICATION (17918080)
Main Inventor
Anbang YAO
NOR GATE BASED LOCAL ACCESS LINE DESELECT SIGNAL GENERATION (17725384)
Main Inventor
Yasir Mohsin Husain
SELF-RESETTING CLOCK GENERATOR (17728256)
Main Inventor
Gururaj Shamanna
MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF INTEGRATED CIRCUIT STRUCTURES (18216984)
Main Inventor
Mehmet O. BAYKAN
SIZE AND EFFICIENCY OF DIES (18216989)
Main Inventor
Mathew J. MANUSHAROW
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS (18216102)
Main Inventor
Adel A. ELSHERBINI
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE (18216005)
Main Inventor
Nicholas NEAL
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE (18214742)
Main Inventor
Andrew COLLINS
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (18346321)
Main Inventor
Debendra Mallik
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD (18217000)
Main Inventor
David O'SULLIVAN
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (17728147)
Main Inventor
Omkar G. Karhade
TECHNIQUES FOR DIE TILING (18216275)
Main Inventor
Srinivas PIETAMBARAM
INTEGRATED CIRCUIT STRUCTURES WITH SOURCE OR DRAIN DOPANT DIFFUSION BLOCKING LAYERS (18216563)
Main Inventor
Cory BOMBERGER
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS (18216282)
Main Inventor
Feras EID
METHODS AND APPARATUS TO AUTONOMOUSLY IMPLEMENT POLICIES AT THE EDGE (18344714)
Main Inventor
Mark Yarvis
METHODS AND APPARATUS TO INCREASE PRIVACY FOR FOLLOW-ME SERVICES (18343671)
Main Inventor
Akhilesh Thyagaturu
SECURE AND ATTESTABLE FUNCTIONS-AS-A-SERVICE (18216412)
Main Inventor
Ned M. Smith
METHODS AND APPARATUS FOR SECURED INFORMATION TRANSFER (18345865)
Main Inventor
Ned Smith
PACKET BASED IN-LINE PROCESSING FOR DATA CENTER ENVIRONMENTS (18216524)
Main Inventor
Susanne M. BALLE
ENHANCED MAPPING MECHANISM FOR TRANSMISSION IDENTIFIER TO LINK IN NON-COLLOCATED ACCESS POINT MULTI-LINK DOWNLINK SYSTEMS (18341551)
Main Inventor
Laurent CARIOU
RELEASE-18 (REL-18) SUPPORT OF TWO TIMING ADVANCES (TAS) FOR SINGLE CELL (18307484)
Main Inventor
Xun Tang
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFERENT THICKNESSES (18344944)
Main Inventor
Brandon C. Marin
COMPACT REAR MOUNTED HEAT EXCHANGERS AND RELATED METHODS (18344620)
Main Inventor
Shaorong Zhou
