US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)
Organization Name
Inventor(s)
Debendra Mallik of Chandler AZ (US)
Sergio Antonio Chan Arguedas of Chandler AZ (US)
Chandra Mohan Jha of Tempe AZ (US)
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18346321 Titled 'MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)'
Simplified Explanation
The abstract describes a microelectronic package that includes a die and a package substrate. The die is connected to the package substrate using solder thermal interface material (STIM) thermal interconnects. An integrated heat spreader (IHS) is also connected to the STIM thermal interconnects. A thermal underfill material is placed between the IHS and the die, surrounding the STIM thermal interconnects. The abstract suggests that there may be other embodiments or variations of this microelectronic package.
Original Abstract Submitted
Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.
