US Patent Application 17725018. THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC INTEGRATED CIRCUIT (PIC) simplified abstract
Contents
THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC INTEGRATED CIRCUIT (PIC)
Organization Name
Inventor(s)
Chia-Pin Chiu of Tempe AZ (US)
Omkar G. Karhade of Chandler AZ (US)
Kaveh Hosseini of Livermore CA (US)
THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC INTEGRATED CIRCUIT (PIC) - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17725018 Titled 'THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC INTEGRATED CIRCUIT (PIC)'
Simplified Explanation
The abstract describes a thermal structure for a type of integrated circuit called an open cavity photonic integrated circuit (OCPIC). This structure includes an air trench that is connected to an air cavity located beneath a component called a micro-ring resonator (MRR). The air trench is a gap in the surrounding oxide material and extends outward from the MRR in a straight line. The structure also has an oxide cladding that is not removed in areas where metal traces and routing are needed. The structure is characterized by having a consistent width along the air trench and a lower diameter at the bottom of the air cavity. In some cases, this lower diameter is the same as the diameter of the air trench.
Original Abstract Submitted
Variations in a thermal structure for an open cavity photonic integrated circuit (OCPIC) having an MRR. The structure includes an air trench in fluid communication with an air cavity that is located under the MRR. The air trench is a gap/opening in the oxide that encircles at least a portion of the MRR and extends outward radially therefrom, with a consistent width, to a diameter D1. An oxide cladding is not removed in areas that are used for metal traces and routing. The structure is characterized by straight walls along the air trench. The structure has a lower diameter D2, measured at a bottom/floor of the air cavity. In various embodiments, D2 is substantially equal to D1.
