US Patent Application 18216005. SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE simplified abstract
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE
Organization Name
Inventor(s)
Nicholas Neal of Scottsdale AZ (US)
Nicholas S. Haehn of Mesa AZ (US)
Sergio Chan Arguedas of Chandler AZ (US)
Edvin Cetegen of Chandler AZ (US)
Jacob Vehonsky of Gilbert AZ (US)
Steve S. Cho of Chandler AZ (US)
Antariksh Rao Pratap Singh of Gilbert AZ (US)
Tarek A. Ibrahim of Mesa AZ (US)
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18216005 Titled 'SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STATE THERMAL PERFORMANCE'
Simplified Explanation
This abstract describes electronic packages with thermal solutions. The electronic package includes a package substrate, a first die connected to the package substrate, and an integrated heat spreader (IHS) that is thermally connected to the surface of the first die. The IHS consists of a main body with an outer perimeter and one or more legs attached to the outer perimeter, which are supported by the package substrate. Additionally, there is a thermal block between the package substrate and the main body of the IHS, located within the outer perimeter of the main body.
Original Abstract Submitted
Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.
