US Patent Application 18216102. MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
Contents
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ (US)
Amr Elshazly of Hillsboro OR (US)
Arun Chandrasekhar of Chandler AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18216102 Titled 'MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS'
Simplified Explanation
The abstract describes microelectronic assemblies and related devices and methods. These assemblies consist of a package substrate, a first die connected to the substrate using first interconnects, and a second die connected to the first die using second interconnects. The second die is also connected to the package substrate using third interconnects. The first and second dies contain a communication network, which includes a pathway for communication between them.
Original Abstract Submitted
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
