US Patent Application 18216282. MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
Organization Name
Inventor(s)
Sasha N. Oster of Marion IA (US)
Telesphor Kamgaing of Chandler AZ (US)
Georgios C. Dogiamis of Chandler AZ (US)
Aleksandar Aleksov of Chandler AZ (US)
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18216282 Titled 'MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS'
Simplified Explanation
The abstract describes a microelectronic device that consists of two substrates. The first substrate contains radio frequency components, while the second substrate is connected to the first substrate and includes a conductive layer for transmitting and receiving communications at a frequency of 4 GHz or higher. A dielectric material is placed between the two conductive layers of the antenna unit to capacitively couple them.
Original Abstract Submitted
Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
