US Patent Application 17729974. PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS simplified abstract
Contents
PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ (US)
PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17729974 Titled 'PLASMONIC JUNCTION ON A PACKAGE FOR ENHANCING EVANESCENT COUPLING OF OPTICAL INTERCONNECTS'
Simplified Explanation
The abstract describes optical interconnects and methods of creating them. These interconnects involve embedding an optical waveguide in a package substrate. A photonics integrated circuit (PIC) is placed over the substrate, which includes a laser that can be connected to the optical waveguide. Additionally, a plasmonic junction is included between the laser and the optical waveguide.
Original Abstract Submitted
Embodiments disclosed herein include optical interconnects and methods of forming such optical interconnects. In an embodiment, the optical interconnect comprises a package substrate, where an optical waveguide is embedded in the package substrate. In an embodiment, a photonics integrated circuit (PIC) is over the package substrate, where the PIC comprises a laser that is configured to be optically coupled to the optical waveguide. In an embodiment, the optical interconnect further comprises a plasmonic junction between the laser and the optical waveguide.
