US Patent Application 18214742. CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract
Contents
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE
Organization Name
Inventor(s)
Andrew Collins of Chandler AZ (US)
Sujit Sharan of Chandler AZ (US)
Jianyong Xie of Chandler AZ (US)
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18214742 Titled 'CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE'
Simplified Explanation
The abstract describes a package substrate that includes a die package located underneath a power delivery interface in a die. The package substrate has connection terminals on its surface that provide connection to the die. Inside the die package, there are metal-insulator-metal layers that are connected to the connection terminals.
Original Abstract Submitted
A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.
