US Patent Application 18217000. FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD simplified abstract
Contents
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
Organization Name
Inventor(s)
David O'sullivan of Ottobrunn (DE)
Georg Seidemann of Landshut (DE)
Richard Patten of Langquaid (DE)
Bernd Waidhas of Pettendorf (DE)
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18217000 Titled 'FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD'
Simplified Explanation
The abstract describes semiconductor packages and a method of creating them. These packages consist of a mold that surrounds a first die and a first via. The package also includes a conductive pad on the top surface of the first die and/or the mold. Additionally, there is a second die with a solder ball attached to a die pad on its bottom surface. This solder ball is connected to the conductive pad of the first die. The first die and second die are connected through a first redistribution layer. The second die is positioned within the footprint of the first die, with one edge inside and the other edge outside the footprint.
Original Abstract Submitted
Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.
