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Category:CPC H01L23/5223
Pages in category "CPC H01L23/5223"
The following 153 pages are in this category, out of 153 total.
1
- 18088541. INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH simplified abstract (Intel Corporation)
- 18128490. MIM FLUX CAPACITOR WITH THIN AND THICK METAL LEVELS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18145840. DECOUPLING MIM CAPACITOR simplified abstract (International Business Machines Corporation)
- 18150385. INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18186545. STRUCTURE TO MITIGATE VERTICAL INTERCONNECT ACCESS INDUCED METAL CORROSION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18188965. METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER simplified abstract (QUALCOMM Incorporated)
- 18214102. CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18334430. METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18335754. METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18335838. METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18337069. METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18346495. CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHODS OF FORMATION (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18467163. PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK (QUALCOMM Incorporated)
- 18472837. CORRUGATED CAPACITOR (TEXAS INSTRUMENTS INCORPORATED)
- 18473887. CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18483695. EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485346. LINE-VIA-LINE STRUCTURE FOR BSPDN (International Business Machines Corporation)
- 18541147. SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract (Samsung Electronics Co., Ltd.)
- 18590242. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)
- 18599597. ON-CHIP CAPACITORS IN SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18604310. STRUCTURE AND METHOD FOR INTERLEVEL DIELECTRIC LAYER WITH REGIONS OF DIFFERING DIELECTRIC CONSTANT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18606944. DECOUPLING CAPACITORS WITH BACK SIDE POWER RAILS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18616727. INTEGRATED CIRCUIT WITH TUNABLE CAPACITOR ARRAY (Apple Inc.)
- 18625690. SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR EMBEDDED THEREIN (Samsung Electronics Co., Ltd.)
- 18738100. SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR INTEGRATED CIRCUITS HAVING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18748662. EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER (Samsung Electronics Co., Ltd.)
- 18791593. STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE (SAMSUNG ELECTRONICS CO., LTD.)
- 18936438. SEMICONDUCTOR DEVICE (Sumitomo Electric Industries, Ltd.)
- 18963780. SEMICONDUCTOR DEVICE (NANYA TECHNOLOGY CORPORATION)
- 18973267. MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18977704. SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS (Taiwan Semiconductor Manufacturing Co., Ltd.)
2
- 20250174547. Semiconductor Device Met (DENSO)
- 20250183151. Mim Capacitor Di (United Microelectronics .)
- 20250183152. High Voltage Is (TEXAS INSTRUMENTS INCORPORATED)
- 20250183153. Capacitor Between Two Passivation Layers Different Etching Ra (Taiwan Semiconductor Manufacturing , .)
- 20250218928. Trench Capacitor Intercon (Intel)
- 20250218929. Embedded Deep Trench Capacit (Intel)
- 20250233064. Integrated Capa (Murata Manufacturing ., .)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2025
- Advanced Micro Devices, Inc Patent Application Trends in 2025
- ADVANCED MICRO DEVICES, INC. Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple inc. (20250132244). INTEGRATED CIRCUIT WITH TUNABLE CAPACITOR ARRAY
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- Apple Inc. patent applications on April 24th, 2025
D
I
- Intel corporation (20240213140). INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH simplified abstract
- Intel corporation (20240404943). INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES
- Intel corporation (20240404943). INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES simplified abstract
- Intel corporation (20240429155). INTEGRATED CAPACITOR
- Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on December 26th, 2024
- Intel Corporation patent applications on December 5th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 27th, 2025
- International business machines corporation (20240213141). DECOUPLING MIM CAPACITOR simplified abstract
- International business machines corporation (20240421064). METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- International business machines corporation (20240421067). METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- International business machines corporation (20250125250). LINE-VIA-LINE STRUCTURE FOR BSPDN
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on April 17th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on December 19th, 2024
- International Business Machines Corporation patent applications on February 20th, 2025
- International Business Machines Corporation patent applications on January 23rd, 2025
- International Business Machines Corporation patent applications on June 27th, 2024
M
Q
- Qualcomm incorporated (20240203866). INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract
- Qualcomm incorporated (20240321724). METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER simplified abstract
- Qualcomm incorporated (20250096111). PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- Qualcomm incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on June 20th, 2024
- QUALCOMM Incorporated patent applications on March 20th, 2025
- QUALCOMM Incorporated patent applications on September 26th, 2024
S
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240213143). SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract
- Samsung electronics co., ltd. (20240421068). SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR INTEGRATED CIRCUITS HAVING THE SAME
- Samsung electronics co., ltd. (20250014985). SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR EMBEDDED THEREIN
- Samsung electronics co., ltd. (20250014986). EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Samsung electronics co., ltd. (20250062221). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250140682). STORAGE DEVICE INCLUDING CAPACITOR REMOVABLY MOUNTED ON CASE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on May 1st, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent Application Trends in 2025
- Semiconductor Energy Laboratory Co., Ltd. Patent Application Trends in 2025
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2024
- STMicroelectronics (Rousset) SAS Patent Application Trends in 2024
- STMicroelectronics (Rousset) SAS Patent Application Trends in 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240222264). DECOUPLING CAPACITORS WITH BACK SIDE POWER RAILS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250018). STRUCTURE AND METHOD FOR INTERLEVEL DIELECTRIC LAYER WITH REGIONS OF DIFFERING DIELECTRIC CONSTANT simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240421065). METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Taiwan semiconductor manufacturing co., ltd. (20240421066). METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20240429156). Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Copper Redistribution Layer Scheme
- Taiwan semiconductor manufacturing co., ltd. (20250105137). MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Taiwan semiconductor manufacturing co., ltd. (20250105138). SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS
- Taiwan semiconductor manufacturing co., ltd. (20250118654). EMBEDDING A METAL-INSULATOR-METAL CAPACITOR IN A PASSIVATION LAYER
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240321723). STRUCTURE TO MITIGATE VERTICAL INTERCONNECT ACCESS INDUCED METAL CORROSION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379528). METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379529). METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379530). INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379531). BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379532). NOVEL MIM STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250014984). CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHODS OF FORMATION
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 23rd, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 9th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Texas instruments incorporated (20250105135). CORRUGATED CAPACITOR
- TEXAS INSTRUMENTS INCORPORATED patent applications on March 27th, 2025