Texas instruments incorporated (20250105135). CORRUGATED CAPACITOR
CORRUGATED CAPACITOR
Organization Name
texas instruments incorporated
Inventor(s)
[[:Category:Jonas H�henberger of Kissing DE|Jonas H�henberger of Kissing DE]][[Category:Jonas H�henberger of Kissing DE]]
Michael Hans Enzelberger-heim of Munich DE
CORRUGATED CAPACITOR
This abstract first appeared for US patent application 20250105135 titled 'CORRUGATED CAPACITOR
Original Abstract Submitted
the present disclosure generally relates to a corrugated capacitor in an integrated circuit (ic). in an example, an ic includes a first corrugated conductive layer, a second corrugated conductive layer, and a corrugated dielectric layer. the first corrugated conductive layer and the second corrugated conductive layer are over a semiconductor substrate. the corrugated dielectric layer is between the first corrugated conductive layer and the second corrugated conductive layer. various examples may achieve a larger surface areas for respective plates of a capacitor for a given lateral footprint of the capacitor.