Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
Organization Name
Inventor(s)
Adel A. Elsherbini of Chandler AZ US
Chia-Ching Lin of Portland OR US
Sou-Chi Chang of Portland OR US
Thomas Lee Sounart of Chandler AZ US
Tushar Kanti Talukdar of Wilsonville OR US
Johanna Marie Swan of Scottsdale AZ US
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
This abstract first appeared for US patent application 20250105136 titled 'CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
Original Abstract Submitted
capacitors for use with integrated circuit packages are disclosed. an example apparatus includes a semiconductor substrate, a metal layer coupled to the semiconductor substrate, a dielectric layer coupled to the metal layer, the dielectric layer including a capacitor disposed therein, and an interface layer positioned between the metal layer and the dielectric layer, the interface layer in contact with the dielectric layer and in contact with the metal layer.
- Intel corporation
- Kimin Jun of Portland OR US
- Adel A. Elsherbini of Chandler AZ US
- Chia-Ching Lin of Portland OR US
- Sou-Chi Chang of Portland OR US
- Thomas Lee Sounart of Chandler AZ US
- Tushar Kanti Talukdar of Wilsonville OR US
- Johanna Marie Swan of Scottsdale AZ US
- Uygar Avci of Portland OR US
- H01L23/522
- H01L23/00
- H01L23/498
- H01L23/528
- H01L23/538
- H01L25/065
- H01L25/16
- CPC H01L23/5223