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Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

From WikiPatents

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

Organization Name

intel corporation

Inventor(s)

Kimin Jun of Portland OR US

Adel A. Elsherbini of Chandler AZ US

Chia-Ching Lin of Portland OR US

Sou-Chi Chang of Portland OR US

Thomas Lee Sounart of Chandler AZ US

Tushar Kanti Talukdar of Wilsonville OR US

Johanna Marie Swan of Scottsdale AZ US

Uygar Avci of Portland OR US

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

This abstract first appeared for US patent application 20250105136 titled 'CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

Original Abstract Submitted

capacitors for use with integrated circuit packages are disclosed. an example apparatus includes a semiconductor substrate, a metal layer coupled to the semiconductor substrate, a dielectric layer coupled to the metal layer, the dielectric layer including a capacitor disposed therein, and an interface layer positioned between the metal layer and the dielectric layer, the interface layer in contact with the dielectric layer and in contact with the metal layer.

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