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Category:Suddhasattwa Nad of Chandler AZ (US)
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Pages in category "Suddhasattwa Nad of Chandler AZ (US)"
The following 42 pages are in this category, out of 42 total.
1
- 17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)
- 17846303. SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 17847652. STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
- 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
- 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17851999. MULTI-PATHWAY ROUTING VIA THROUGH HOLE simplified abstract (Intel Corporation)
- 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)
- 17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17956750. NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract (Intel Corporation)
- 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation)
- 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)
- 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
- 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
- 17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
I
- Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240111089). NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract
- Intel corporation (20240111092). PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract
- Intel corporation (20240111095). HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract
- Intel corporation (20240112973). METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
- Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract
- Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract
- Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract
- Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240114627). ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract
- Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract