17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation)
Contents
- 1 PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the coating on the bumps prevent solder wicking?
- 1.11 What materials are used for the insulative baffles on the substrate?
- 1.12 Original Abstract Submitted
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Mohammad Mamunur Rahman of Gilbert AZ (US)
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17938784 titled 'PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Simplified Explanation
The abstract describes a microelectronic assembly with an integrated circuit (IC) die coupled to a package substrate using solder interconnects of different sizes, with bumps on the IC die and bond-pads on the substrate. The bumps have a coating to prevent solder wicking, and the substrate includes insulative baffles between the bond-pads.
- Larger first interconnects and smaller second interconnects made of solder are used to connect the IC die to the package substrate.
- Bumps on the IC die and bond-pads on the substrate are coupled with solder.
- The bumps have a coating to prevent solder wicking.
- Insulative baffles are present between the bond-pads on the substrate.
Potential Applications
The technology described in the patent application could be applied in the manufacturing of microelectronic devices, such as smartphones, tablets, and other electronic gadgets.
Problems Solved
This technology helps in improving the reliability and performance of microelectronic assemblies by preventing solder wicking and providing insulative baffles to reduce the risk of short circuits.
Benefits
The benefits of this technology include enhanced reliability, improved performance, and reduced risk of short circuits in microelectronic assemblies.
Potential Commercial Applications
The technology could be commercially applied in the production of consumer electronics, industrial equipment, automotive components, and other electronic devices.
Possible Prior Art
One possible prior art could be the use of different sizes of solder interconnects in microelectronic assemblies to improve reliability and performance.
Unanswered Questions
How does the coating on the bumps prevent solder wicking?
The abstract mentions that the lateral sides of the bumps have a coating to prevent solder wicking, but it does not provide details on the specific mechanism by which this is achieved.
What materials are used for the insulative baffles on the substrate?
While the abstract mentions the presence of insulative baffles between the bond-pads on the substrate, it does not specify the materials used for these baffles or how they are integrated into the assembly.
Original Abstract Submitted
Embodiments of a microelectronic assembly includes: a package substrate and an integrated circuit (IC) die coupled to a surface of the package substrate by first interconnects and second interconnects, the first interconnects and the second interconnects comprising solder. The first interconnects are larger than the second interconnects, the first interconnects and the second interconnects further comprise bumps on the IC die and bond-pads on the surface of the package substrate, with the solder coupled to the bumps and the bond-pads, lateral sides of the bumps have a coating of a material that prevents solder wicking, and the surface of the package substrate includes insulative baffles between the bond-pads.
